1064nm DFB Laser Diode Butterfly Module with TEC

Specifications

Center Wavelength: 1.064 um
Output Power: 36 mW
Jacket: ∅900 um
Connector: FC/APC
Fiber Length: 1 m
Fiber Type: SM CORNING HI1060
Resistance Value: 10 KΩ
TEC Current: 2.5 mA
TEC Voltage: 4 V
Side Mode Suppression Ratio: 35 dB
Peak Wavelength: 1062-1066 nm
Wavelength Current Coefficient: 0.005 nm/mA
Wavelength Temperature Coefficient: 0.08 nm/℃
Forward Voltage: 1.5-2 V
Slope Efficiency (Front Facet): 0.5-0.9 W/A
Output Optical Power: 20-36 mW
Threshold Current: 20-30 mA
Laser Forward Current: 500 mA
Laser Reverse Voltage: 2 V
Optical Output Power: 250 mW
Operation Temperature: -60 ℃
Storage Temperature: -85 ℃
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Features

  • High Reliability: Designed for consistent performance and durability.
  • Applications: Ideal for Metrology, Seed Laser, and Spectroscopy.
  • Integrated Components: Built-in TEC, thermistor, and MPD within a 14 PIN butterfly package.
  • Hermetic Design: Meets telecommunication standards with narrow linewidth and high power.
  • Customization: Supports customer-specified pin definition customization.
  • Fiber Type: SM CORNING HI1060 with FC/APC connector.
  • Fiber Length: 1 meter from module case to fiber end.
  • Electro-Static Discharge (ESD) Precautions: Ensure proper grounding and use of antistatic materials during handling and transportation.

Applications

  • Metrology
  • Seed laser
  • Spectroscopy