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Laser Cutters

The WXR-220UD is a high-precision laser cutting and depaneling machine designed to meet the demands of PCB and FPC manufacturing. This dual-platform machine offers exceptional precision, speed, and compatibility, making it an ideal solution for cutting and depaneling flexible and rigid circuit boards. With an integrated laser cutting ...

Specifications

Work Area / Panel Length: 300 mm
Work Area / Panel Width: 500 mm
Work Area / Panel Thickness (Max): 2 mm
Scan Field: Other (see specs)
Scan Speed: 300 mm/sec
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Good-Laser Light 640 series cutting & engraving machine We adopted first-class components, high-quality production, and a strict inspection process that aggregated into a high-performance and stable laser machine. With precise cutting and engraving, to meet the laser creation needs of all science and innovation education ...

Specifications

Format: Tower
Laser Source: CO2
Laser Output Power: 60/80 W
Laser Wavelength: 10.6 um (IR)
Beam Delivery: 3 axis
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Good-Laser Light 530Desktop CO2 laser cutting & engraving machine 60W Laser Power, 950mm Laser tube length  A wonder box to fulfill every of your fantastic idea Made for makers and STEAM education  

Specifications

Format: Benchtop
Laser Source: CO2
Laser Output Power: 60 W
Laser Wavelength: 10.6 um (IR)
Beam Delivery: 3 axis
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Laser cutting is an advanced technique used in material processing. The laser cutting machine produced by our company is equipped with precision linear guides and high-precision rack and pinion transmission mechanism. It is a precision CNC laser cutting workstation assembled through a professional laser cutting CNC ...

Specifications

Platform Type: Gantry
Materials: Steel, Iron, Alloy, Aluminum, Brass, Copper, Nickel, Titanium, Plastic, Wood, Granite, Rubber, Polymers
Laser Type: Fiber Laser
Max Laser Output Power: 3000 W
Processing Length (X): 3000 mm
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Laser cutting is an advanced technique used in material processing. The laser cutting machine produced by our company is equipped with precision linear guides and high-precision rack and pinion transmission mechanism. It is a precision CNC laser cutting workstation assembled through a professional laser cutting CNC ...

Specifications

Platform Type: Gantry
Materials: Steel, Iron, Alloy, Aluminum, Brass, Copper, Nickel, Titanium, Glass, Plastic, Wood, Ceramic, Rubber, Acrylic, Polymers
Laser Type: Fiber Laser
Max Laser Output Power: 6000 W
Processing Length (X): 6000 mm
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Solar Cell Nondestructive Laser Cutting Machine MLC7200C4-A
Han's Laser Corporation
The dicing process used in the production of high-efficiency photovoltaic modules replaces the conventional laser dicing machine. The core principle of non-destructive laser cutting is laser thermal stress-controlled fracture technology, which uses laser to locally heat the material and produce a temperature gradient on the ...

Specifications

Wafer Size: 150 mm (~6 in), 200 mm (~8 in), 300 mm (~12 in)
Spindle Rotation Speed: -- rpm
X-Axis Stroke (Cutting Range): 150 mm
X-Axis Speed: -- mm/s
X-Axis Resolution: 120 um
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TITANIUM 5 Axis Laser Dicing Machine
OGI Systems LTD
Titanium is the most precise Laser Dicing Machine for ultra-hard materials and excellent to processed PCD, CBN, PCBN and CVD DIAMOND tools. With Titanium easy to create any abrasives tools for honing ring, grinding wheels, Milling Cutter, cutting inserts, Gear Cutting Tools, Chamfer & Deburring Tools, CBN Insert and more.The ...

Specifications

Wafer Size: 200 mm (~8 in)
Spindle Rotation Speed: -- rpm
X-Axis Stroke (Cutting Range): 200 mm
X-Axis Speed: -- mm/s
X-Axis Resolution: -- um
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AD2000T-S Fully Automatic Dicing Machine
TOKYO SEIMITSU CO., LTD
8-inches Fully Automatic Dicing Machine. Achieved smallest footprint possible utilizing our own core technology.

Specifications

Wafer Size: 200 mm (~8 in)
Spindle Rotation Speed: 60000 rpm
X-Axis Stroke (Cutting Range): 260 mm
X-Axis Speed: 1000 mm/s
X-Axis Resolution: -- um
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ML301EXWH Laser Dicing Machine
TOKYO SEIMITSU CO., LTD
12-inches laser dicing machine with wafer handling system and visible light microscope.It's a fully integrated system that offers ease of operation, accuracy and high throughput.

Specifications

Wafer Size: 200 mm (~8 in), 300 mm (~12 in)
Spindle Rotation Speed: -- rpm
X-Axis Stroke (Cutting Range): 550 mm
X-Axis Speed: -- mm/s
X-Axis Resolution: 2 um
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AD3000T-PLUS Fully Automatic Dicing Machine
TOKYO SEIMITSU CO., LTD
This is a Fully Automatic Dicing Machine capable of stealth dicing 12" wafers.Tokyo Seimitsu Dicing Machine realizes the remarkable “CoO (Cost of Ownership)” by the world smallest footprint, high throughput, and high processing quality reinforced by the collaboration of the up-to-date technology.

Specifications

Wafer Size: 300 mm (~12 in)
Spindle Rotation Speed: 60000 rpm
X-Axis Stroke (Cutting Range): 310 mm
X-Axis Speed: 1000 mm/s
X-Axis Resolution: -- um
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DFL7341 Fully Automatic Laser Saw
DISCO Corporation
Achieves high productivity for sapphire, lithium tantalate, and MEMS processing. Stealth Dicing™ process can be performed based on the wafer surface height, making it possible to reliably process wafers with significant warpage. Stealth Dicing™ process can be performed based on the wafer surface height, making it possible to ...

Specifications

Wafer Size: 200 mm (~8 in)
Spindle Rotation Speed: 1000 rpm
X-Axis Stroke (Cutting Range): 210 mm
X-Axis Speed: 1000 mm/s
X-Axis Resolution: 0.1 um
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DFL7362 Fully Automatic Laser Saw
DISCO Corporation
Laser saw compatible with various processes which achieves high-speed, high-quality processing of ultra-thin Si. DFL7362 is compatible with a wide range of options related to quality and productivity, such as wafer thickness measurement and non-stop kerf check.

Specifications

Wafer Size: 300 mm (~12 in)
Spindle Rotation Speed: 2000 rpm
X-Axis Stroke (Cutting Range): 310 mm
X-Axis Speed: 2000 mm/s
X-Axis Resolution: 0.1 um
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microCELLTM TLS High-Throughput Laser System
3D Micromac
3D-Micromac is taking advantage of the Thermal Laser Separation™ (TLS) technology, especially for use cases within photovoltaic production. The patented process has gained importance in contrast to conventional separation techniques due to smooth and defect-free cutting edges. This leads to a significantly higher module power ...

Specifications

Wafer Size: 300 mm (~12 in)
Spindle Rotation Speed: -- rpm
X-Axis Stroke (Cutting Range): 300 mm
X-Axis Speed: 300 mm/s
X-Axis Resolution: -- um
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microDICE Enabling TLS-DicingTM System
3D Micromac
3D-Micromac’s high-performance microDICE™ laser dicing system separates wafers into dies using TLS-Dicing™ technology (Thermal-Laser-Separation). microDICE™ significantly reduces the dicing cost per wafer compared to traditional separation technologies. At the same time, cleaving with microDICE™ provides outstanding edge quality ...

Specifications

Wafer Size: 300 mm (~12 in)
Spindle Rotation Speed: -- rpm
X-Axis Stroke (Cutting Range): -- mm
X-Axis Speed: 300 mm/s
X-Axis Resolution: -- um
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Silicon Wafer Laser Dicing and Scribing Machine
Shenzhen Beyond Laser Technology Co., Ltd
Silicon Wafer Laser Dicing and Scribing Machine is equipped with a picosecond laser and offer a high throughput, cost effective and simple way to dice and scribe wafers with high accuracy and long term reliability.Copper laminate wafers with multi-layers of different materials with varying hardness and density is difficult to ...

Specifications

Wafer Size: 450 mm (17.7 in), 675 mm (26.6 in)
Spindle Rotation Speed: -- rpm
X-Axis Stroke (Cutting Range): 650 mm
X-Axis Speed: 800 mm/s
X-Axis Resolution: -- um
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With a 48"x24" workspace and up to a 100W Power, the Muse Titan Laser Cutting and Engraving Machine is the largest desktop laser out there, but it can still fit through a standard doorway. Inspire. Design. Create.Muse Titan has a large cutting area of 48"x24" but can fit through any door way and placed on a standard tabletop. ...

Specifications

Format: Desktop
Laser Source: CO2
Laser Output Power: 90 W
Laser Wavelength: 10.6 um (IR)
Beam Delivery: Flatbed
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Muse Fiber Galvo V2 laser engraving and marking machine offers unbeatable performance. Easily engrave metal, polymers, and more with precision using the 50W Muse Fiber Galvo configurations.    Fast and Versatile Fast rotating stationary mirrors project a beam of light down with no physical movement of the laser head to ...

Specifications

Format: Desktop
Laser Source: Fiber
Laser Output Power: 50 W
Laser Wavelength: 1064 nm (IR)
Beam Delivery: Galvo
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DB-241218 7 Axis Laser Workstation
Mundt
DB-241218 7 Axis Laser Workstation is a standalone flatbed platform for various laser cutting applications. Its generous workspace and CNC capabilities makes it an ideal choice for various industrial applications.

Specifications

Platform Type: Portable
Materials: Steel, Iron, Alloy, Aluminum, Brass, Copper, Gold, Silver, Nickel, Titanium, Platinum
Laser Type: Fiber Laser
Max Laser Output Power: -- W
Processing Length (X): 610 mm
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The GCC LabelExpress laser die cutter is a high-speed label cutting system that delivers high flexibility and great precision with an intuitive operation. With the state-of-the-art CCD module, auto-feed system, waste removal module and re-winder device, as well as an optional slitting module. LabelExpress provides an ...

Specifications

Format: Tabletop
Laser Source: CO2
Laser Output Power: 30 W
Laser Wavelength: 10.6 um (IR)
Beam Delivery: Other (see specs)
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GT-1000 Laser Workstation
Mundt
This workstation is easily accessible and convenient from all four sides.The GT-1000 features very large X and Y Axes on a welded steel base, with a sturdy cantilevered arm on a hefty Z Axis. The rigid arm is ideal for a tool changer for swapping out laser focusing heads.

Specifications

Platform Type: Gantry
Materials: Steel, Iron, Alloy, Aluminum, Brass, Copper, Gold, Silver, Nickel, Titanium, Platinum
Laser Type: Fiber Laser
Max Laser Output Power: -- W
Processing Length (X): 1219 mm
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The DecalExpress is dedicated to satisfying different needs for garment décor market. The powerful SmartCONTROL software makes the operation easier and performs multiplex parameters in one cutting job. The specially designed waste drawer collects unnecessary materials when die cutting, providing a smooth workflow without job ...

Specifications

Format: Tabletop
Laser Source: CO2
Laser Output Power: 30 W
Laser Wavelength: 10.6 um (IR)
Beam Delivery: Other (see specs)
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The DecalExpress is dedicated to satisfying different needs for garment décor market. The powerful SmartCONTROL software makes the operation easier and performs multiplex parameters in one cutting job. The specially designed waste drawer collects unnecessary materials when die-cutting, providing a smooth workflow without job ...

Specifications

Format: Tabletop, Desktop
Laser Source: CO2
Laser Output Power: 20 W
Laser Wavelength: 10.6 um (IR)
Beam Delivery: Other (see specs)
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L-Star 450-510 L-Star 450 Watt Laser Cutting System
Vytek
The newest laser in the L-Star series is the L-Star 450 Watt. It has all of the features of the LST series, but with the added capabilities of a 450-watt, water cooled laser. This system is available in 4 standard sizes: LST 4848 (4' x 4') LST4896 (4' x 8') and LST610 (6' x 10'), as well as custom sizes. This system can cut ...

Specifications

Format: Benchtop
Laser Source: CO2
Laser Output Power: 450 W
Laser Wavelength: 10.6 um (IR)
Beam Delivery: Flatbed, Large Flatbed Platform
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LST4896 L-Star Laser Cutting System
Vytek
The newest laser in the L-Star series is the L-Star 450 Watt. It has all of the features of the LST series, but with the added capabilities of a 450-watt, water cooled laser. This system is available in 4 standard sizes: LST 4848 (4' x 4') LST4896 (4' x 8') and LST610 (6' x 10'), as well as custom sizes. This system can cut ...

Specifications

Format: Benchtop
Laser Source: CO2
Laser Output Power: 170 W
Laser Wavelength: 10.6 um (IR)
Beam Delivery: Flatbed, Large Flatbed Platform
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GX4896 Laser Cutting Machine
Vytek
Designed with an ultra-lightweight gantry, the Vytek GX Laser System provides maximum productivity and usability. Combined with the industry standard communication protocols, the GX System is unbeatable in speed, performance and flexibility. Adding to its impressive capabilities, the GX System also works with LaserworxTM ...

Specifications

Format: Benchtop
Laser Source: CO2
Laser Output Power: 200 W
Laser Wavelength: 10.6 um (IR)
Beam Delivery: Large Flatbed Platform
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Frequently Asked Questions

Laser cutting is a highly precise cutting technology that utilizes a focused laser beam to cut, drill, perforate and depanel various materials. Because of the localized nature of energy deposition through a focused laser beam, the cuts made by laser cutters are extremely precise. Add to this the CNC capabilities, and laser cutters become the most precise cutting machines on the market. Laser cutters generate very smooth edges and are capable of cutting various objects without damaging or warping the surrounding material.

Yes, most laser cutters come with integrated CNC capabilities allowing to program predefined shapes. Combined with precision laser beam steering technology this allows cutting very complex shapes and intricate details.

The primary drawback of laser cutters is their cost compared with competing technologies such as plasma cutting, waterjet cutting, mechanical cutting, sawing etc. That said laser cutting can actually be more economical on large volume projects requiring precision. The savings would come from lower maintenance costs, limited consumables and minimized scrap. Laser cutting will also require some training for expert operation of the machine even though most modern laser cutting machines are very user friendly.

The laser beam can be dangerous when coming into contact with skin or in case of a direct eye exposure. Most laser systems have safety features to mitigate this. Additionally, fumes created during laser cutting can be hazardous and care must be taken to extract them through a special fume extraction unit. The level of toxicity of the generated fumes will largely depend on the materials being cut.

The laser cutting process relies on the energy exerted onto the material by the laser beam. Depending on the wavelength of the laser beam in the laser cutting machine many materials including, wood, paper, cork, plastics metals can be cut by a laser cutter. With that said, not all materials can be cut with any laser cutter. The laser wavelength, output power, cutting speed, and repetition rate all play an important role on the capability and generated quality of a laser cutting machine.

The thickness of the cutting depends on what is being cut, i.e. the type of materials. Many laser cutters work in the range between 0.5mm to 15mm, and this will depend strongly on the laser parameters and the material properties.

Before selecting a laser cutter, you will need to carefully consider your application. What objects and materials are you going to cut? Is laser cutting the only process that you will use or would you also like to drill and engrave objects? Many laser cutters are multifunctional and you will want to select a unit that fits your applications. Additionally you will want to consider the work area, and laser specifications including the power, wavelength, repetition rate, as well as the CNC and integration capabilities. With all these parameters defined you will also want to consider your available budget and juxtapose this with other competing technologies.

FindLight offers a wide selection of laser cutters for various industrial and research applications. Choose from 3D laser cutters, PCB laser depaneling systems, laser drills, and more from top suppliers and manufacturers. Whether you need precision cutting, marking, or engraving, our laser cutters provide high-quality results for a range of materials, including metals, plastics, and ceramics. Browse our extensive catalog, compare specifications and prices, and contact suppliers directly for a quote. With our intuitive search and filter options, finding the perfect laser cutter for your needs has never been easier. Trust FindLight to connect you with the best laser cutting solutions on the market.

Did You know?

Did you know that laser cutting is a versatile and precise method of material processing? Laser cutters use a high-powered laser beam to cut through a wide range of materials, including metals, plastics, wood, and fabrics. The laser beam is controlled by a computer program, which allows for intricate designs and shapes to be cut with ease. Different types of laser cutters are available for various applications. For example, 3D laser cutters use multiple laser beams to cut through materials from different angles, creating complex three-dimensional shapes. PCB laser depaneling systems are designed specifically for separating printed circuit boards into individual components. Laser drills are used to create precise holes in materials that would be difficult to achieve with traditional drilling methods. When choosing a laser cutter, consider factors such as the size and thickness of the materials you need to cut, the level of precision required, and the type of laser source used. With the right laser cutter, you can achieve fast, precise, and cost-effective material processing for a wide range of applications.