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Laser Depaneling Machines

Optowave 355nm UV Laser Depaneler – Precision, Stress-Free PCB Cutting The Optowave 355nm PCB Laser Depaneler provides a high-precision, stress-free solution for cutting PCBs, FPCs, and rigid-flex boards. Powered by a Q-switched, diode-pumped solid-state UV laser, this advanced machine uses a non-contact cutting process to ...

Specifications

Work Area / Panel Length: 400 mm
Work Area / Panel Width: 400 mm
Work Area / Panel Thickness (Max): Not Specified
Scan Field: Not specified
Scan Speed: 2500 mm/sec
This Laser Depaneling Machine is a powerful and advanced pcb separator machine, pcb board cutting machine and pcb cutter machine. It is designed to provide high depth cutting, software-controlled operations and depaneling of FR4/FPC materials. The machine is equipped with 10W/12W/15W/18W@30KHz laser power and the maximum working area ...

Specifications

Work Area / Panel Length: 400 mm
Work Area / Panel Width: 300 mm
Work Area / Panel Thickness (Max): 600 mm
Scan Field: Other (see specs)
Scan Speed: 2500 mm/sec
Challenges of Depaneling using Routing/Die Cutting/Dicing Saws Damages and fractures to substrates and circuits due to mechanical stressDamages to PCB due to accumulated debrisConstant need for new bits, custom dies, and bladesLack of versatility – each new application requires ordering of custom tools, blades, and diesNot ...

Specifications

Work Area / Panel Length: 460 mm
Work Area / Panel Width: 460 mm
Work Area / Panel Thickness (Max): 600 mm
Scan Field: > 250 x 250 mm^2
Scan Speed: 2500 mm/sec
Automatic Pneumatic Pcb Depanelizer Tool, CWVC-3 Printed Circuit Board Depaneling Machine   1. Motorized Linear Blade Depanelizer ( CWVC-3) 2. Shears boards safely with parts as close as 0.5mm to the score line, including ceramic capacitors 3. Operator foolproof! Panels cannot be inserted into the knives except on the score ...

Specifications

Work Area / Panel Length: 600 mm
Work Area / Panel Width: 600 mm
Work Area / Panel Thickness (Max): 3 mm
Scan Field: > 250 x 250 mm^2
Panel Material: FR4, Metal, Rigid PCB, Double-Sided PCB
PCB Separator Routing Solutions with KAVO Spindle at 60000RPM Specifications: Model     CW-F01-SStandard working area     320*320mmPower   220V, 4.2KWManipulator Repeatability   ±0.02mmResolution   ±0.01mmBoard Positioning   Dual workstation with ...

Specifications

Work Area / Panel Length: 350 mm
Work Area / Panel Width: 350 mm
Work Area / Panel Thickness (Max): 3 mm
Scan Field: > 250 x 250 mm^2
Panel Material: FR4, Ceramics, Metal, Rigid PCB, Double-Sided PCB
The laser depaneling machine is a high-performance pcb cutting machine, PCB laser cutting machine and pcb depaneling machine with a laser wavelength of 355nm, designed for cutting various materials with high cutting depth. It is capable of depaneling FR30 and FPC at a frequency of 4KHz with a laser power of 10W, 12W, 15W or 18W. With ...

Specifications

Work Area / Panel Length: 330 mm
Work Area / Panel Width: 320 mm
Work Area / Panel Thickness (Max): Not Specified
Scan Field: > 250 x 250 mm^2
Scan Speed: 2500 mm/sec
Stress-free depaneling with 18W UV laser head, no tooling costs Laser depaneling: The CWVC-5L laser depaneling machine combines innovative technologies to provide the flexibility of a traditional drill router and the speed of a depaneling press in a completely stress-free, dust-reduced laser depaneling solution. Stress-free ...

Specifications

Work Area / Panel Length: 600 mm
Work Area / Panel Width: 460 mm
Work Area / Panel Thickness (Max): Not Specified
Scan Field: Other (see specs)
Scan Speed: 2500 mm/sec
It is a stand alone router machine specially designed to route (depanelize) printed circuit board assemblies (PCBA) into individual assemblies. The machine can accomodate larger PCB in its two table configuration with maximum panel size of 650mm x 500mm. Its advanced control software provides user friendly "visual" programming for ...

Specifications

Work Area / Panel Length: 400 mm
Work Area / Panel Width: 400 mm
Work Area / Panel Thickness (Max): 3 mm
Scan Field: > 250 x 250 mm^2
Scan Speed: 300 mm/sec
PCB Rouer Machine and Laser Depaneling MachineThe laser depaneling machine is a software-controlled machine used for depaneling FR4 and FPCs. It can cut a variety of materials and comes with a friendly working environment and a large cutting area, making it suitable for online or offline PCB laser depaneling. This laser PCB ...

Specifications

Work Area / Panel Length: 300 mm
Work Area / Panel Width: 300 mm
Work Area / Panel Thickness (Max): Not Specified
Scan Field: Other (see specs)
Scan Speed: 2500 mm/sec
The Economic PCB Punching Machine is designed for efficient, low-stress separation of PCBs and flexible printed circuits (FPCs). Featuring a pneumatically driven system with electric control, it enables high-precision depaneling through customizable punching dies. Its cast iron frame ensures long-term rigidity, while the modular die ...

Specifications

Work Area / Panel Length: Not Specified
Work Area / Panel Width: Not Specified
Work Area / Panel Thickness (Max): Not Specified
Scan Field: Other (see specs)
Scan Speed: Not Specified
PCB Depaneling Equipment V-Cut PCB Separator with CE ISO Certification Details 1. Easy maintenance and operation2. Thin PCB even to 0.3mm can be sheared safely3. Shearing process without vibrations due to pneumatic drive unit 

Specifications

Work Area / Panel Length: Not Specified
Work Area / Panel Width: Not Specified
Work Area / Panel Thickness (Max): 3.5 mm
Scan Field: Not specified
Scan Speed: Not Specified
This latest technology of double directions depaneling with horizontal and vertical boards can satisfy your needs. It can both realize inline depaneling for shape panels as well as one direction of depaneling. Low labor costs are achieved due to the high automation and connectivity with PCB loaders and unloaders. Moreover, it has a ...

Specifications

Work Area / Panel Length: Not Specified
Work Area / Panel Width: Not Specified
Work Area / Panel Thickness (Max): Not Specified
Scan Field: Other (see specs)
Scan Speed: Not Specified
The CWV-1M Manual V-Cut PCB Separator is a precision depaneling machine designed to separate pre-scored PCBs quickly and efficiently without damaging components or stressing the board. With adjustable blade clearance, a durable stainless steel platform, and manual operation via rotary control, it is ideal for small to medium ...

Specifications

Work Area / Panel Length: 350 mm
Work Area / Panel Width: 350 mm
Work Area / Panel Thickness (Max): 3 mm
Scan Field: Other (see specs)
Scan Speed: Not Specified
LED Multi Group Multi Blade PCB Cutting Machine     This is LED multi group multi blade cutting machine CWVC-5.It is an automated equipment and it can butt joint your production line equipment.It can cut all kind of boards. 10pcbs in one panel ,19 pieces blade can cut without any problem.

Specifications

Work Area / Panel Length: 320 mm
Work Area / Panel Width: 320 mm
Work Area / Panel Thickness (Max): 3 mm
Scan Field: Other (see specs)
Scan Speed: Not Specified
This PCB Separator features a high-precision XYZ servo motor system combined with a ball screw and linear guide rail to ensure smooth and accurate operation. It delivers a moving accuracy of less than 0.05mm and routing accuracy also within 0.05mm. The rotary dual work station design enables continuous operation, significantly ...

Specifications

Work Area / Panel Length: 450 mm
Work Area / Panel Width: 350 mm
Work Area / Panel Thickness (Max): 3.5 mm
Scan Field: > 250 x 250 mm^2
Scan Speed: 3500 mm/sec
Standing out from numerous brands, such as LPKF Cutting Master, R-TEK RTC series, Hans Laser HDZ-UVC3030,etc., Veshay WXR-220US is a high-precision laser cutting and depaneling machine designed to meet the demands of PCB and FPC manufacturing. 

Specifications

Work Area / Panel Length: 500 mm
Work Area / Panel Width: 350 mm
Work Area / Panel Thickness (Max): 1 mm
Scan Field: 50 x 50 mm^2
Scan Speed: 3000 mm/sec
The WXR-220UD is a high-precision laser cutting and depaneling machine designed to meet the demands of PCB and FPC manufacturing. This dual-platform machine offers exceptional precision, speed, and compatibility, making it an ideal solution for cutting and depaneling flexible and rigid circuit boards. With an integrated laser cutting ...

Specifications

Work Area / Panel Length: 300 mm
Work Area / Panel Width: 500 mm
Work Area / Panel Thickness (Max): 2 mm
Scan Field: Other (see specs)
Scan Speed: 300 mm/sec

Frequently Asked Questions

One of the most cutting-edge methods for separating printed circuit boards (PCBs) from the entire panel of arrays is referred to as laser depaneling. Printed circuit boards (PCBs) that have already been manufactured in arrays on large panels require a careful separation before they can be used as individual electronic components. Laser depaneling machines are specially designed laser cutters with CNC capabilities that allow an automated cutting (detachment) of PCBs from larger panels

As you consider adopting laser depaneling machines for your PCB fabrication process you should take into account the total cost of ownership to calculate the proper unit economics. Laser depaneling is a clean, environmentally friendly process that can save on consumables. It also will save you on scrap costs thanks to a high degree of accuracy and repeatability. In a long run the cost of ownership can be justified depending on volume production and the machinery used. Because of the great variance in the range of parameters and features the price on individual machines can vary significantly. Please do not hesitate to inquire pricing on any model of interest.

Laser depaneling offers high-precision cuts, free of dust and carbonization. Thanks to its minimally invasive approach it can depanel PCBs with no mechanical stress or damage due to non-contact and vibration-free separation. Its high accuracy and repeatability allows fabricating with minimal scrap and material usage.

There are several parameters and options to look for when choosing the right laser depaneling system for your applications. Work and scan fields are two important parameters that along with max cutting speed will determine you production capacity. Laser output, including the source (fiber, CO2, DPSS, etc.), the output power and the wavelength will determine the list of materials that they can operate on. Before selecting a machine, please ensure that it is designed to cut through the material you intend to cut.

Laser depaneling offers unique features that are advantages over mechanical methods of cutting. This includes the high production speed leading to increased output, lower cost of ownership in the long term, less material usage (thanks to scrap savings and the absence of consumable), high precision and accuracy.

Laser depaneling machines can operate on most common PCB board materials including on FFR4, FPCB, Ceramics, SIP, PTFE, Metal, Rigid PCB, Double-Sided PCB, etc. If in doubt, please do not hesitate to inquire; suppliers on FindLight will be eager to respond to your questions.

Precision and Efficiency: The Role of Laser Depaneling Machines in Modern Electronics Manufacturing

In the rapidly evolving electronics industry, the demand for precision, efficiency, and reliability has never been higher. Laser depaneling machines have emerged as a critical solution, offering unparalleled accuracy and speed in separating individual printed circuit boards (PCBs) from larger panels.​

Understanding Laser Depaneling

Laser depaneling is a non-contact method that utilizes focused laser beams to cut PCBs from a fabricated panel. Unlike traditional mechanical methods, such as routing or die-cutting, laser depaneling eliminates physical stress on the boards, reducing the risk of damage to delicate components.​

The process involves directing a laser beam along predefined paths, precisely cutting through the substrate material. This technique ensures clean edges, minimal thermal impact, and high repeatability, making it ideal for complex and sensitive electronic assemblies.​

Advantages of Laser Depaneling Machines

  • High Precision: Laser depaneling achieves micron-level accuracy, essential for densely populated and miniaturized PCBs.​

  • Stress-Free Processing: The non-contact nature of laser cutting prevents mechanical stress, preserving the integrity of components and solder joints.​

  • Versatility: Capable of handling various materials, including FR4, polyimide, ceramics, and flexible PCBs, laser depaneling machines cater to diverse manufacturing needs.​

  • Clean and Burr-Free Edges: The precision of laser cutting results in smooth edges without burrs, reducing the need for post-processing.​

  • Reduced Waste: The accuracy of laser depaneling minimizes material waste, contributing to cost savings and environmental sustainability.​

Applications Across Industries

Laser depaneling machines are integral to numerous sectors:​

  • Consumer Electronics: Manufacturing smartphones, tablets, and wearable devices that require compact and intricate PCBs.​

  • Automotive Industry: Producing electronic control units and sensor modules with high reliability standards.​

  • Medical Devices: Creating precise and reliable PCBs for diagnostic equipment and implantable devices.​

  • Aerospace and Defense: Fabricating complex electronic systems where precision and durability are paramount.​

Selecting the Right Laser Depaneling Machine

When choosing a laser depaneling machine, consider the following factors:

  • Material Compatibility: Ensure the machine can process the specific materials used in your PCBs.​

  • Laser Type: Different lasers (e.g., UV, CO₂, fiber) offer varying advantages depending on the application.​

  • Cutting Speed and Accuracy: Evaluate the machine's performance metrics to match your production requirements.​

  • Automation and Integration: Look for machines that can seamlessly integrate into existing production lines and offer automation features.​

  • Maintenance and Support: Consider the availability of technical support and the ease of maintenance to ensure long-term reliability.​

Conclusion

Laser depaneling machines represent a significant advancement in PCB manufacturing, offering unmatched precision, efficiency, and flexibility. By adopting this technology, manufacturers can enhance product quality, reduce operational costs, and meet the growing demands of modern electronics production. Explore the range of laser depaneling machines on FindLight to find the solution that best fits your operational needs.

Did You know?

Laser Depaneling Machines (also known as PCB Depaneling Machines) are special laser cutting systems to carefully detach printed circuit boards (PCBs) from the panel they are printed on. In mass manufacturing PCBs are printed on a relatively large panel with batches. To make individual circuit boards those units need to be cut out (“depaneled”) from the array of circuits on the panel. Thanks to advances of laser as well as laser beam delivery technologies PCB laser depaneling has become the current standard in electronic manufacturing industry. The cutting precision offered by current laser sources offers unmatched precision in the slicing process. Availability of sources in a wide spectral range from UV to IR ensures operating capability on nearly any surface. Similarly, laser beam delivery technology offer X-Y-Z scanning capabilities with micron level precision.