Optowave 355nm PCB Laser Depaneling Machine with No Pressure PCB Cutting

东莞市创威智能装备有限公司

Specifications

Work Area / Panel Length: 400 mm
Work Area / Panel Width: 400 mm
Work Area / Panel Thickness (Max): Not Specified
Scan Field: Not specified
Scan Speed: 2500 mm/sec
Laser Output Power: 18 W
Laser Wavelength: 355 nm
Axis Speed (X): Not Specified
Axis Speed (Y): Not Specified
Axis Speed (Z): Not Specified
Accuracy: Not Specified
Panel Material: FPCB, Rigid PCB, Double-Sided PCB
Max PCB Size: 600*460 mm
Positioning Precision Of Worktable Of Linear Motor: ±2 μm
Repetition Precision Of Worktable Of Linear Motor: ±1 μm
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Features

Non-contact cutting eliminates mechanical stress on PCBs and components
UV 355nm Q-switched diode-pumped solid-state laser for high precision
Available laser power: 10W, 12W, 15W or 18W @ 30kHz
±2μm positioning accuracy with linear motor table
±1μm repeatability for consistent accuracy
Maximum laser scan speed: 2500mm/s for efficient processing
Customizable effective working area up to 400mm x 300mm
Minimal burrs and less delamination for longer sheet life
Small kerfs, less dust and cleaner edges
Short set-up time, ideal for small batches
Reliable performance and long service life

Applications



  • FPC (flexible printed circuit) cutting


    Soft and hard PCB separation


    Standard PCB separation


    Camera module separation
    Precision cutting of precision electronic substrates
    Low-stress processing of high-value circuit boards



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