Optowave 355nm PCB Laser Depaneling Machine with No Pressure PCB Cutting
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How to order?
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Ships from:
China
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Sold by:
东莞市创威智能装备有限公司 -
On FindLight:
since 2025
Description
Optowave 355nm UV Laser Depaneling Machine – Precision, No-Pressure PCB Cutting
The Optowave 355nm PCB Laser Depaneling Machine offers a high-precision, stress-free solution for cutting PCBs, FPCs, and rigid-flex boards. Powered by a Q-switched, diode-pumped solid-state UV laser, this advanced machine utilizes a non-contact cutting process to minimize mechanical stress, micro-cracks, and delamination, preserving the integrity and lifespan of delicate electronic components.
With a laser wavelength of 355nm and configurable laser power up to 18W, this machine delivers fine, narrow cuts with minimal dust or burrs, making it ideal for high-precision electronics manufacturing. Its fast scanning speed, exceptional repeatability, and customizable work area make it well-suited for high-mix, low-volume production environments. Whether you're depaneling FPCs, rigid-flex PCBs, or camera modules, the Optowave machine delivers clean, consistent results every time.
Optowave 355nm PCB Laser Depaneling Machine with No Pressure PCB Cutting
Specifications |
|
|---|---|
| Work Area / Panel Length: | Not Specified |
| Work Area / Panel Width: | Not Specified |
| Work Area / Panel Thickness (Max): | Not Specified |
| Scan Field: | Not specified |
| Scan Speed: | Not Specified |
| Laser Output Power: | Not Specified |
| Laser Wavelength: | Not Specified |
| Axis Speed (X): | Not Specified |
| Axis Speed (Y): | Not Specified |
| Axis Speed (Z): | Not Specified |
| Accuracy: | Not Specified |
| Panel Material: | FPCB, Rigid PCB, Double-Sided PCB |
Features
- Non-contact cutting eliminates mechanical stress on PCBs and components
- UV 355nm Q-switched diode-pumped solid-state laser for high precision
- Available laser powers: 10W, 12W, 15W, or 18W @ 30kHz
- ±2μm positioning precision with linear motor worktable
- ±1μm repetition precision for consistent accuracy
- Max laser scanning speed: 2500mm/s for efficient processing
- Customizable effective working field up to 400mm x 300mm
- Minimal burrs and reduced delamination, increasing board lifespan
- Fine, narrow kerfs with less dust and cleaner edges
- Quick setup times, ideal for small production batches
- Reliable performance over long operational life
Applications
- FPC (Flexible Printed Circuit) cutting
- Rigid-Flex PCB depaneling
- Standard PCB singulation
- Camera module separation
- Precision cutting of delicate electronic substrates
- Low-stress processing of high-value circuit boards
Frequently Asked Questions
The machine uses a Q-switched diode-pumped solid-state UV laser with a 355nm wavelength, ideal for high-precision, no-pressure PCB cutting.
UV lasers at 355nm provide fine, precise cuts with minimal thermal impact, reducing the risk of micro-cracks, delamination, and component damage.
Yes, it is specifically designed for FPCs, rigid-flex PCBs, and other delicate materials requiring stress-free depaneling.
The effective working field is 400mm x 300mm, and it is customizable based on customer needs.
Absolutely. The machine allows fast setup times, making it ideal for high-mix, low-volume production environments.
The machine is available in 10W, 12W, 15W, and 18W laser power configurations at 30kHz.
Minimal. The non-contact laser cutting process significantly reduces burrs and dust compared to traditional mechanical methods.
It is optimized for PCB-related materials such as FPCs and camera modules. Use with non-PCB materials should be evaluated case by case.
Compliance and certification details should be confirmed with the manufacturer or distributor based on your regional safety requirements.
Most distributors or manufacturers offer setup guidance, training, and ongoing technical support—please inquire at the time of purchase.