Veshay WXR-220US Single Platform PCB Laser Depaneling Machine PCB Laser Cutting System
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How to order?
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Ships from:
China
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Sold by:
Dongguan Veshay Laser Technology Co., Ltd -
On FindLight:
since 2024
Description
Standing out from numerous brands, such as LPKF Cutting Master, R-TEK RTC series, Hans Laser HDZ-UVC3030,etc., Veshay WXR-220US is a high-precision laser cutting and depaneling machine designed to meet the demands of PCB and FPC manufacturing.
Veshay WXR-220US Single Platform PCB Laser Depaneling Machine PCB Laser Cutting System
Specifications |
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|---|---|
| Work Area / Panel Length: | 500 mm |
| Work Area / Panel Width: | 350 mm |
| Work Area / Panel Thickness (Max): | 1 mm |
| Scan Field: | 50 x 50 mm^2 |
| Scan Speed: | 3000 mm/sec |
| Laser Output Power: | 20 W |
| Laser Wavelength: | 355 nm |
| Axis Speed (X): | 1000 mm/sec |
| Axis Speed (Y): | 1000 mm/sec |
| Accuracy: | 2 um |
| Panel Material: | FR4, FPCB, Metal, Rigid PCB, Double-Sided PCB |
| Laser: | 20W UV Laser, Nanosecond |
| Cutting Format: | 350mm×300mm |
| Platform: | Single Work Table |
| Application Objects: | FPC、PCB |
| Comprehensive Accuracy: | ±0.025mm |
| Loading And Unloading: | Manually |
| Support Files: | DXF 、DWG, etc. |
| Operation System: | WIN10 |
| Equipment Weight: | 1.2 Ton |
| Power Supply: | Three-Phase AC380V/50Hz/8KW |
| Air Supply: | Air Compression ，0.6~0.8MPa，100LPM，Φ10 |
| Venue Load-bearing: | 1000kg/m2 |
| Environment: | Temperature- 24℃±2°C; Humidity <60% no condensation |
Features
This single-platform machine offers exceptional precision, speed, and compatibility and also occupies smaller footprint, making it an ideal solution for cutting and depaneling flexible and rigid circuit boards. With an integrated laser cutting mechanism and adjustable platform, it ensures optimal performance across a variety of materials such as LCP, MPI, PI, FR4, FR5, and more.
Applications
Veshay WXR-220US Single-Platform De-paneling Machine, as a precision equipment developed by our company to meet with market demands, is mainly used for shape cutting and depaneling FPC and PCB product, etc. The equipment consists of a laser cutting mechanism, cutting and positioning mechanism, cutting and dust removal mechanism and cutting platform mechanism. Lengths and widths for cutting various products can be adjusted manually.
Frequently Asked Questions
The Laser Depaneling Machine is used for shape cutting and depaneling FPC and PCB products, among other applications.
The main features include strong compatibility, high precision, fast speed, good stability, and a compact size.
The WXR-220UD uses a 20W UV laser with nanosecond pulse duration.
The cutting format of the WXR-220UD is 350mm × 500mm.
The comprehensive accuracy of the machine is ±0.025mm.
UV lasers provide high accuracy, narrow cut joints, lower thermal impact, and are compatible with a variety of materials.
The machine can process materials like LCP, MPI, PI, FR4, FR5, CEM, Polyester, Ceramic, and other RF materials.