Veshay WXR-220US Single Platform PCB Laser Depaneling Machine PCB Laser Cutting System

Dongguan Veshay Laser Technology Co., Ltd

Specifications

Work Area / Panel Length: 500 mm
Work Area / Panel Width: 350 mm
Work Area / Panel Thickness (Max): 1 mm
Scan Field: 50 x 50 mm^2
Scan Speed: 3000 mm/sec
Laser Output Power: 20 W
Laser Wavelength: 355 nm
Axis Speed (X): 1000 mm/sec
Axis Speed (Y): 1000 mm/sec
Accuracy: 2 um
Panel Material: FR4, FPCB, Metal, Rigid PCB, Double-Sided PCB
Laser: 20W UV Laser, Nanosecond
Cutting Format: 350mm×300mm
Platform: Single Work Table
Application Objects: FPC、PCB
Comprehensive Accuracy: ±0.025mm
Loading And Unloading: Manually
Support Files: DXF 、DWG, etc.
Operation System: WIN10
Equipment Weight: 1.2 Ton
Power Supply: Three-Phase AC380V/50Hz/8KW
Air Supply: Air Compression ，0.6~0.8MPa，100LPM，Φ10
Venue Load-bearing: 1000kg/m2
Environment: Temperature- 24℃±2°C; Humidity <60% no condensation
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Features

This single-platform machine offers exceptional precision, speed, and compatibility and also occupies smaller footprint, making it an ideal solution for cutting and depaneling flexible and rigid circuit boards. With an integrated laser cutting mechanism and adjustable platform, it ensures optimal performance across a variety of materials such as LCP, MPI, PI, FR4, FR5, and more.

Applications

Veshay WXR-220US Single-Platform De-paneling Machine, as a precision equipment developed by our company to meet with market demands, is mainly used for shape cutting and depaneling FPC and PCB product, etc. The equipment consists of a laser cutting mechanism, cutting and positioning mechanism, cutting and dust removal mechanism and cutting platform mechanism. Lengths and widths for cutting various products can be adjusted manually.