Description
The WXR-220UD is a high-precision laser cutting and depaneling machine designed to meet the demands of PCB and FPC manufacturing. This dual-platform machine offers exceptional precision, speed, and compatibility, making it an ideal solution for cutting and depaneling flexible and rigid circuit boards. With an integrated laser cutting mechanism and adjustable platform, it ensures optimal performance across a variety of materials such as LCP, MPI, PI, FR4, FR5, and more.
Veshay has been involved deeply in the line of PCB, with main products such as PCB Data Loggers, Visualizing Laser Marking machines, PCB Laser Marking Machines, and PCB Depaneling Machine, etc. We are now serving 400 customers home and abroad with high-quality products and after-sales service, as well as automatic equipment.
Double Platform Depaneling Machine, as a precision equipment developed by our company to meet with market demands, is mainly used for shape cutting and depaneling FPC and PCB product, etc. The equipment consists of a laser cutting mechanism, cutting and positioning mechanism, cutting and dust removal mechanism and cutting platform mechanism. Lengths and widths for cutting various products can be adjusted manually.
Double Platform High Precision PCB Laser Depaneling Machine: Veshay WXR-220UD
Specifications
| Work Area / Panel Length: | 300 mm |
|---|---|
| Work Area / Panel Width: | 500 mm |
| Work Area / Panel Thickness (Max): | 2 mm |
| Scan Field: | Other (see specs) |
| Scan Speed: | 300 mm/sec |
| Laser Output Power: | 20 W |
| Laser Wavelength: | 355 nm |
| Axis Speed (X): | 1000 mm/sec |
| Axis Speed (Y): | 1000 mm/sec |
| Axis Speed (Z): | 1000 mm/sec |
| Accuracy: | 1 um |
| Panel Material: | Not Specified |
| Equipment: | Double Platform High Precision Laser Cutting Machine |
| Style No.: | WXR-220UD |
| Laser: | 20W UV Laser, Nanosecond |
| Application Objects: | CP, MPI,PI,FR4,FR5, and CEM and Polyester, Ceramic and other RF Material |
| Comprehensive Accurancy: | ±0.025mm |
| Operation System: | WIN10 |
| Equipment Weight: | About 2.5K Ton |
Download Data Sheet
Features
- Strong Compatibility: Supports various materials including LCP, MPI, PI, FR4, FR5, CEM, and polyester.
- High Precision: Ensures accurate cutting with minimal tolerances.
- Fast Speed: Increases production efficiency while maintaining precision.
- Good Stability: Robust design for consistent performance in high-demand environments.
- Compact Size: Space-saving design suitable for different manufacturing setups.
- User-Friendly Interface: Software and hardware fully developed in-house for ease of use.
Applications
- Semiconductors: Cutting and depaneling of semiconductor components.
- Integrated Circuits: Ideal for precision cutting in IC manufacturing.
- Communication Equipment: Suitable for components used in communication devices.
- Lighting: Efficiently processes materials for lighting products.
- Flexible and Rigid Circuit Boards: Designed for FPC and PCB cutting and depaneling tasks.
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