Laser Depaneling Machines

Optowave 355nm PCB Laser Depaneling Machine with No Pressure PCB Cutting

Optowave 355nm PCB Laser Depaneling Machine with No Pressure PCB Cutting

Optowave 355nm UV Laser Depaneler – Precision, Stress-Free PCB Cutting The Optowave 355nm PCB Laser Depaneler provides a high-precision, stress-free solution for cutting PCBs, FPCs, and rigid-flex boards. ...

Specifications
Work Area / Panel Length: 400 mm
Work Area / Panel Width: 400 mm
Work Area / Panel Thickness (Max): Not Specified
Scan Field: Not specified
Scan Speed: 2500 mm/sec
Large Area PCB Depaneling Machine for FR4 / FPC 355nm Laser Wavelength

Large Area PCB Depaneling Machine for FR4 / FPC 355nm Laser Wavelength

This Laser Depaneling Machine is a powerful and advanced pcb separator machine, pcb board cutting machine and pcb cutter machine. It is designed to provide high depth cutting, software-controlled operations and ...

Specifications
Work Area / Panel Length: 400 mm
Work Area / Panel Width: 300 mm
Work Area / Panel Thickness (Max): 600 mm
Scan Field: Other (see specs)
Scan Speed: 2500 mm/sec
Optional Online or Offline Laser PCBA-FPC Laser Depaneling Machine with 355nm Laser Wavelength

Optional Online or Offline Laser PCBA-FPC Laser Depaneling Machine with 355nm Laser Wavelength

Challenges of Depaneling using Routing/Die Cutting/Dicing Saws Damages and fractures to substrates and circuits due to mechanical stressDamages to PCB due to accumulated debrisConstant need for new bits, custom ...

Specifications
Work Area / Panel Length: 460 mm
Work Area / Panel Width: 460 mm
Work Area / Panel Thickness (Max): 600 mm
Scan Field: > 250 x 250 mm^2
Scan Speed: 2500 mm/sec
LED Pcb Depanelizer Tool, CWVC-3 Printed Circuit Board Depaneling Machine

LED Pcb Depanelizer Tool, CWVC-3 Printed Circuit Board Depaneling Machine

Automatic Pneumatic Pcb Depanelizer Tool, CWVC-3 Printed Circuit Board Depaneling Machine   1. Motorized Linear Blade Depanelizer ( CWVC-3) 2. Shears boards safely with parts as close as 0.5mm to the score ...

Specifications
Work Area / Panel Length: 600 mm
Work Area / Panel Width: 600 mm
Work Area / Panel Thickness (Max): 3 mm
Scan Field: > 250 x 250 mm^2
Panel Material: FR4, Metal, Rigid PCB, Double-Sided PCB
Customized PCB Routing Machine PCB Router,PCB Depaneling Router System,PCB Thickness 0.5-3.5mm

Customized PCB Routing Machine PCB Router,PCB Depaneling Router System,PCB Thickness 0.5-3.5mm

PCB Separator Routing Solutions with KAVO Spindle at 60000RPM Specifications: Model     CW-F01-SStandard working area     320*320mmPower   220V, 4.2KWManipulator ...

Specifications
Work Area / Panel Length: 350 mm
Work Area / Panel Width: 350 mm
Work Area / Panel Thickness (Max): 3 mm
Scan Field: > 250 x 250 mm^2
Panel Material: FR4, Ceramics, Metal, Rigid PCB, Double-Sided PCB
330*320mm Dual workarea Laser Depaneling Machine 2500mm/s High Speed Excellent Cut Finish

330*320mm Dual workarea Laser Depaneling Machine 2500mm/s High Speed Excellent Cut Finish

The laser depaneling machine is a high-performance pcb cutting machine, PCB laser cutting machine and pcb depaneling machine with a laser wavelength of 355nm, designed for cutting various materials with high cutting ...

Specifications
Work Area / Panel Length: 330 mm
Work Area / Panel Width: 320 mm
Work Area / Panel Thickness (Max): Not Specified
Scan Field: > 250 x 250 mm^2
Scan Speed: 2500 mm/sec
FPC PCB Laser separator With 18W UV Laser Head PCBA FPCA

FPC PCB Laser separator With 18W UV Laser Head PCBA FPCA

Stress-free depaneling with 18W UV laser head, no tooling costs Laser depaneling: The CWVC-5L laser depaneling machine combines innovative technologies to provide the flexibility of a traditional drill ...

Specifications
Work Area / Panel Length: 600 mm
Work Area / Panel Width: 460 mm
Work Area / Panel Thickness (Max): Not Specified
Scan Field: Other (see specs)
Scan Speed: 2500 mm/sec
Inline or Offline PCB Router Machine PCB Depanelizer Automated Robot

Inline or Offline PCB Router Machine PCB Depanelizer Automated Robot

It is a stand alone router machine specially designed to route (depanelize) printed circuit board assemblies (PCBA) into individual assemblies. The machine can accomodate larger PCB in its two table configuration ...

Specifications
Work Area / Panel Length: 400 mm
Work Area / Panel Width: 400 mm
Work Area / Panel Thickness (Max): 3 mm
Scan Field: > 250 x 250 mm^2
Scan Speed: 300 mm/sec
SMT PCB Router Machine PCB Depanelizer with Cutting Accuracy 25um 1 Mil

SMT PCB Router Machine PCB Depanelizer with Cutting Accuracy 25um 1 Mil

PCB Rouer Machine and Laser Depaneling MachineThe laser depaneling machine is a software-controlled machine used for depaneling FR4 and FPCs. It can cut a variety of materials and comes with a friendly working ...

Specifications
Work Area / Panel Length: 300 mm
Work Area / Panel Width: 300 mm
Work Area / Panel Thickness (Max): Not Specified
Scan Field: Other (see specs)
Scan Speed: 2500 mm/sec
Economic PCB Punching Machine – Easy-to-Control Depaneling with Interchangeable Dies

Economic PCB Punching Machine – Easy-to-Control Depaneling with Interchangeable Dies

The Economic PCB Punching Machine is designed for efficient, low-stress separation of PCBs and flexible printed circuits (FPCs). Featuring a pneumatically driven system with electric control, it enables ...

Specifications
Work Area / Panel Length: Not Specified
Work Area / Panel Width: Not Specified
Work Area / Panel Thickness (Max): Not Specified
Scan Field: Other (see specs)
Scan Speed: Not Specified
PCB Depaneling Equipment V-Cut PCB Separator with CE ISO Certification

PCB Depaneling Equipment V-Cut PCB Separator with CE ISO Certification

PCB Depaneling Equipment V-Cut PCB Separator with CE ISO Certification Details 1. Easy maintenance and operation2. Thin PCB even to 0.3mm can be sheared safely3. Shearing process without vibrations due to ...

Specifications
Work Area / Panel Length: Not Specified
Work Area / Panel Width: Not Specified
Work Area / Panel Thickness (Max): 3.5 mm
Scan Field: Not specified
Scan Speed: Not Specified
PCB Online V Cut Depaneling Equipment 300mm Width Customized

PCB Online V Cut Depaneling Equipment 300mm Width Customized

This latest technology of double directions depaneling with horizontal and vertical boards can satisfy your needs. It can both realize inline depaneling for shape panels as well as one direction of depaneling. Low ...

Specifications
Work Area / Panel Length: Not Specified
Work Area / Panel Width: Not Specified
Work Area / Panel Thickness (Max): Not Specified
Scan Field: Other (see specs)
Scan Speed: Not Specified
Manual V-Cut PCB Depaneling Machine with Circular and Linear Blades for Stress-Free Separation

Manual V-Cut PCB Depaneling Machine with Circular and Linear Blades for Stress-Free Separation

The CWV-1M Manual V-Cut PCB Separator is a precision depaneling machine designed to separate pre-scored PCBs quickly and efficiently without damaging components or stressing the board. With adjustable blade ...

Specifications
Work Area / Panel Length: 350 mm
Work Area / Panel Width: 350 mm
Work Area / Panel Thickness (Max): 3 mm
Scan Field: Other (see specs)
Scan Speed: Not Specified
Durable LED Panel PCB De-panel Separation for Printed Circle Board,Multiple-blade PCB V-cut Machine

Durable LED Panel PCB De-panel Separation for Printed Circle Board,Multiple-blade PCB V-cut Machine

LED Multi Group Multi Blade PCB Cutting Machine     This is LED multi group multi blade cutting machine CWVC-5.It is an automated equipment and it can butt joint your production line equipment.It can cut ...

Specifications
Work Area / Panel Length: 320 mm
Work Area / Panel Width: 320 mm
Work Area / Panel Thickness (Max): 3 mm
Scan Field: Other (see specs)
Scan Speed: Not Specified
PCB Router Depanelizer with Double Working Tables Optional 220V or 110V

PCB Router Depanelizer with Double Working Tables Optional 220V or 110V

This PCB Separator features a high-precision XYZ servo motor system combined with a ball screw and linear guide rail to ensure smooth and accurate operation. It delivers a moving accuracy of less than 0.05mm and ...

Specifications
Work Area / Panel Length: 450 mm
Work Area / Panel Width: 350 mm
Work Area / Panel Thickness (Max): 3.5 mm
Scan Field: > 250 x 250 mm^2
Scan Speed: 3500 mm/sec
Veshay WXR-220US Single Platform PCB Laser Depaneling Machine PCB Laser Cutting System

Veshay WXR-220US Single Platform PCB Laser Depaneling Machine PCB Laser Cutting System

Standing out from numerous brands, such as LPKF Cutting Master, R-TEK RTC series, Hans Laser HDZ-UVC3030,etc., Veshay WXR-220US is a high-precision laser cutting and depaneling machine designed to meet the demands ...

Specifications
Work Area / Panel Length: 500 mm
Work Area / Panel Width: 350 mm
Work Area / Panel Thickness (Max): 1 mm
Scan Field: 50 x 50 mm^2
Scan Speed: 3000 mm/sec
Double Platform High Precision PCB Laser Depaneling Machine: Veshay WXR-220UD

Double Platform High Precision PCB Laser Depaneling Machine: Veshay WXR-220UD

The WXR-220UD is a high-precision laser cutting and depaneling machine designed to meet the demands of PCB and FPC manufacturing. This dual-platform machine offers exceptional precision, speed, and compatibility, ...

Specifications
Work Area / Panel Length: 300 mm
Work Area / Panel Width: 500 mm
Work Area / Panel Thickness (Max): 2 mm
Scan Field: Other (see specs)
Scan Speed: 300 mm/sec

Did You Know?

Laser Depaneling Machines (also known as PCB Depaneling Machines) are special laser cutting systems to carefully detach printed circuit boards (PCBs) from the panel they are printed on. In mass manufacturing PCBs are printed on a relatively large panel with batches. To make individual circuit boards those units need to be cut out (“depaneled”) from the array of circuits on the panel. Thanks to advances of laser as well as laser beam delivery technologies PCB laser depaneling has become the current standard in electronic manufacturing industry. The cutting precision offered by current laser sources offers unmatched precision in the slicing process. Availability of sources in a wide spectral range from UV to IR ensures operating capability on nearly any surface. Similarly, laser beam delivery technology offer X-Y-Z scanning capabilities with micron level precision.

Frequently Asked Questions

One of the most cutting-edge methods for separating printed circuit boards (PCBs) from the entire panel of arrays is referred to as laser depaneling. Printed circuit boards (PCBs) that have already been manufactured in arrays on large panels require a careful separation before they can be used as individual electronic components. Laser depaneling machines are specially designed laser cutters with CNC capabilities that allow an automated cutting (detachment) of PCBs from larger panels

Precision and Efficiency: The Role of Laser Depaneling Machines in Modern Electronics Manufacturing

In the rapidly evolving electronics industry, the demand for precision, efficiency, and reliability has never been higher. Laser depaneling machines have emerged as a critical solution, offering unparalleled accuracy and speed in separating individual printed circuit boards (PCBs) from larger panels.​

Understanding Laser Depaneling

Laser depaneling is a non-contact method that utilizes focused laser beams to cut PCBs from a fabricated panel. Unlike traditional mechanical methods, such as routing or die-cutting, laser depaneling eliminates physical stress on the boards, reducing the risk of damage to delicate components.​

The process involves directing a laser beam along predefined paths, precisely cutting through the substrate material. This technique ensures clean edges, minimal thermal impact, and high repeatability, making it ideal for complex and sensitive electronic assemblies.​

Advantages of Laser Depaneling Machines

  • High Precision: Laser depaneling achieves micron-level accuracy, essential for densely populated and miniaturized PCBs.​

  • Stress-Free Processing: The non-contact nature of laser cutting prevents mechanical stress, preserving the integrity of components and solder joints.​

  • Versatility: Capable of handling various materials, including FR4, polyimide, ceramics, and flexible PCBs, laser depaneling machines cater to diverse manufacturing needs.​

  • Clean and Burr-Free Edges: The precision of laser cutting results in smooth edges without burrs, reducing the need for post-processing.​

  • Reduced Waste: The accuracy of laser depaneling minimizes material waste, contributing to cost savings and environmental sustainability.​

Applications Across Industries

Laser depaneling machines are integral to numerous sectors:​

  • Consumer Electronics: Manufacturing smartphones, tablets, and wearable devices that require compact and intricate PCBs.​

  • Automotive Industry: Producing electronic control units and sensor modules with high reliability standards.​

  • Medical Devices: Creating precise and reliable PCBs for diagnostic equipment and implantable devices.​

  • Aerospace and Defense: Fabricating complex electronic systems where precision and durability are paramount.​

Selecting the Right Laser Depaneling Machine

When choosing a laser depaneling machine, consider the following factors:

  • Material Compatibility: Ensure the machine can process the specific materials used in your PCBs.​

  • Laser Type: Different lasers (e.g., UV, CO₂, fiber) offer varying advantages depending on the application.​

  • Cutting Speed and Accuracy: Evaluate the machine's performance metrics to match your production requirements.​

  • Automation and Integration: Look for machines that can seamlessly integrate into existing production lines and offer automation features.​

  • Maintenance and Support: Consider the availability of technical support and the ease of maintenance to ensure long-term reliability.​

Conclusion

Laser depaneling machines represent a significant advancement in PCB manufacturing, offering unmatched precision, efficiency, and flexibility. By adopting this technology, manufacturers can enhance product quality, reduce operational costs, and meet the growing demands of modern electronics production. Explore the range of laser depaneling machines on FindLight to find the solution that best fits your operational needs.