RedBullet Compact OEM NIR Series Spectrometer

Evolve Sensing

Specifications

Wavelength Range (reflectance): 900 – 1700 nm
Resolution: 12–15 nm (model dependent)
Dimensions: 51.4 × 36.4 × 29 mm
Detector Type: InGaAs (128 or 256 pixels)
Cooling: Passive (no active TEC)
Signal-To-Noise Ratio (SNR): 2000–6700
Thermal Stability: <0.2 nm / °C
A/D Resolution: 16-bit
Integration / Scan Time Range: 6 µs – 24 s
Minimum Scan Time: 0.000006 s
Dynamic Range: 6250–9500
Optical Resolution (FWHM): 12–15 nm
Stray Light: < 0.2 %
Interfaces: USB 2.0 Micro / 4-pin connector
Connector Type: SMA905 fiber
Power Requirements: +5 V DC @ 500 mA (USB)
Operating Temperature: 0 °C – 50 °C
Storage Temperature: –30 °C – 70 °C
Environmental Limits: 0–90 % RH non-condensing
A/D Converter Type: 16-bit ADC @ 15 MHz
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Features

  • Compact concave mirror Czerny–Turner optical design (f/4.5, NA 0.11)
  • InGaAs sensors: 128-pixel (RB4524) or 256-pixel (RB4564)
  • High signal-to-noise ratio with selectable high/low gain modes
  • Configurable slit widths (25 µm, 50 µm, 100 µm) and multiple grating options
  • Integration time: 6 µs – 24 s with fast readout performance
  • Resolution: <15 nm (RB4524, 50 µm slit) / <12 nm (RB4564, 50 µm slit)
  • Low stray light < 0.2% and low dark noise (≤ 10 counts typ.)
  • External 8-pin I/O port with six programmable 3.3 V GPIOs, UART TX/RX, trigger input, and lamp control
  • Flash ROM storage for wavelength, linearity, and intensity calibration coefficients
  • Powered and connected via USB 2.0 (480 Mbps) with Micro USB or 4-pin connector
  • Baseline signal intensity of 1,000 counts (adjustable through SpectraSmart software)
  • Compact and lightweight housing for portable and OEM integration

Applications

  • Near-infrared (NIR) spectroscopy
  • Portable and handheld analytical instruments
  • Process and quality control monitoring
  • Material identification and composition analysis
  • Food, pharmaceutical, and polymer analysis
  • Scientific and industrial sensing
  • Environmental and agricultural monitoring
  • Optical metrology and fiber characterization
  • OEM and embedded system integration