SideWinder NIR Series Spectrometer

Evolve Sensing

Specifications

Wavelength Range (Reflectance): 900–2500 nm (model dependent)
Resolution: 2–22 nm (model dependent)
Dimensions: 110 × 86 × 32.4 mm (SW5) / 130 × 96 × 58.3 mm (SW8/SW9)
Detector Type: InGaAs linear array (128/256/512 px)
Cooling: 1‑stage or 2‑stage TEC (model dependent)
Signal-to-Noise Ratio (SNR): 2000–6000 (model dependent)
Thermal Stability: < 0.1–0.2 nm / °C (model dependent)
A/D Resolution: 16-bit
Integration / Scan Time Range: 100 µs – 24 s (model dependent)
Minimum Scan Time: 0.0001 s
Dynamic Range: 6000–13 000 (model dependent)
Optical Resolution (FWHM): 2–22 nm
Stray Light: < 0.1–0.45 % (model dependent)
Interfaces: USB 2.0 (480 Mbps), 6× GPIO, UART, PWM control
Connector Type: SMA905 fiber
Power Requirements: +5 V DC @ 300–480 mA (USB) (+1.3–2.2 A TEC)
Operating Temperature: 0 °C – 50 °C
Storage Temperature: –30 °C – 70 °C
Environmental Limits: 0–90% RH, non‑condensing
A/D Converter Type: 16‑bit ADC
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Features

  • High-sensitivity InGaAs linear array sensors (128 / 256 / 512 pixels)
  • Wide wavelength coverage — 900–1700 nm, 910–2200 nm, or 900–2500 nm
  • Rugged Czerny–Turner optical design with f/# 5 and NA 0.1 for high stability against temperature, humidity, and vibration
  • 32-bit RISC controller with USB 2.0 (480 Mbps) communication
  • Integration time ranges: 100 µs – 24 s (SW5/8 series); 100 µs – 3000 ms (SW9 series)
  • Configurable slits from 25 – 200 µm (model dependent)
  • High SNR (up to 6000) and dynamic range (up to 13,000) depending on model and gain mode
  • 16-bit, 15 MHz A/D conversion
  • Flash ROM storage for wavelength, linearity, and intensity calibration coefficients
  • Up to 4,000 spectra buffering for continuous acquisition
  • 6 programmable 3.3 V digital I/O pins for external control and trigger input
  • TEC-cooled versions reduce dark noise for long integration times
  • Plug-and-play SpectraSmart software support for spectral measurement and calibration

Applications

  • Near-infrared (NIR) spectroscopy
  • Process and quality control monitoring
  • Material identification and composition analysis
  • Scientific and industrial sensing
  • Environmental and agricultural analysis
  • Optical metrology and fiber characterization
  • OEM and embedded system integration