EagleEye UV-VIS Series Spectrometer

Evolve Sensing

Specifications

Wavelength Range (Reflectance): 180–1100 nm (model dependent)
Resolution: 0.2–10.5 nm (slit/grating dependent)
Dimensions: 130 × 96 × 58.3 mm
Detector Type:: Back-thinned CCD (Hamamatsu S11850 or S16011), 2048 px
Cooling: Thermoelectric (TEC)
Signal-to-Noise Ratio (SNR): 500
Thermal Stability: < 0.015–0.04 nm / °C (model dependent)
A/D Resolution: 16-bit
Integration / Scan Time Range: 5 ms – 65 s
Minimum Scan Time: 0.005 s
Dynamic Range: 4000–5000 (model dependent)
Optical Resolution (FWHM): 0.2–10.5 nm
Stray Light: < 0.04–0.45 % (model dependent)
Interfaces: USB 2.0, 8‑pin I/O (6 GPIO, UART TX/RX, ext. trigger)
Connector Type: SMA905 fiber
Power Requirements: USB +5 V @ ~330 mA; TEC +5 V @ ~500 mA (DC jack)
Operating Temperature: 0 °C – 50 °C
Storage Temperature: –30 °C – 70 °C
Environmental Limits: 0–90 % RH non-condensing
A/D Converter Type: 16-bit ADC
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Features

  • Czerny–Turner optical design with 2nd & 3rd order rejection for low stray light
  • High-sensitivity back-thinned TEC CCD sensor for UV–NIR performance
  • Hamamatsu 2048-pixel linear array sensor (EE2113: S16011; EE2063: S11850)
  • 32-bit RISC controller for precise and stable operation
  • Integration time: 5 ms – 65 s (depending on sensor)
  • Optical resolution: 0.2 – 10.5 nm, depending on slit and grating
  • USB 2.0 high-speed (480 Mbps) communication
  • 8-pin I/O connector with 6 programmable digital I/O lines, UART TX/RX, and external trigger
  • Up to 4,000 spectra buffering for continuous acquisition
  • Flash ROM storage for wavelength, linearity, and intensity calibration data
  • TEC-cooled sensor maintains stable temperature (20–25°C below ambient)
  • Supports Matlab™, LabVIEW™, and SpectraSmart software

Applications

  • UV–NIR spectroscopy and precision optical analysis
  • Raman and fluorescence spectroscopy
  • Thin-film and ellipsometry measurement
  • LED, laser, and light source characterization
  • Scientific and industrial sensing
  • Process and quality control monitoring
  • Environmental and agricultural analysis
  • Material identification and composition analysis
  • OEM and embedded system integration