High Vacuum Motorized Linear Stage X-LSM150B-SV2

Specifications

Number Of Axes: One
Vacuum Grade: 10 mbar
Vacuum Compatibility: 10-6 Torr
Travel Range: 25, 50, 100, 150, 200 mm
Load Capacity: 10 kg
Maximum Speed: 100 mm/s
Power Supply: 24-48 VDC
Microstep Size: 0.1905 µm
Travel Range: 152.4 mm
Accuracy (unidirectional): 46 µm
Vertical Runout: < 8 µm
Horizontal Runout: < 12 µm
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Features


  • Vacuum Compatibility: Designed for high-vacuum environments, compatible up to 10-6 Torr.

  • Varied Travel Options: Available in 25, 50, 100, 150, and 200 mm travel ranges to suit diverse applications.

  • High Load Capacity: Supports up to 10 kg, making it ideal for demanding tasks.

  • Speed and Thrust: Capable of reaching speeds up to 100 mm/s and generating thrust up to 35 N.

  • Integrated Controller: Comes with a built-in controller and can be daisy-chained with other Zaber products for streamlined operation.

  • Minimal Wiring: Requires only 4 feedthrough wires to control all units in a daisy-chain via a serial port (with an X-PIB adaptor).

  • Compact Design: At just 21 mm high, it's perfect for applications requiring a low profile.

  • Easy Connectivity: Connects to RS-232 or USB ports on any computer and shares power in a daisy-chain setup.

  • Precision and Accuracy: Features a default microstep size of 0.1905 µm, with unidirectional accuracy of 46 µm and repeatability of less than 4 µm.

  • Robust Mechanical System: Equipped with a precision lead screw and needle roller bearing guide type for reliable performance.

  • Power Requirements: Operates on a 24-48 VDC power supply, with a maximum current draw of 350 mA.

  • Stepper Motor: Utilizes a 2-phase stepper motor with a rated current of 800 mA/phase.

  • Durable Construction: Built with vacuum-compatible materials to minimize outgassing and reduce pump-down times.

  • Plug and Play: Designed for easy setup and operation, ensuring a hassle-free experience.

Applications


  • Vacuum System Automation: Ideal for precise positioning tasks within vacuum chambers requiring low outgassing materials.

  • Optical Alignment: Enables accurate and stable positioning of optical components in laser and photonics setups.

  • Semiconductor Processing: Suitable for wafer positioning and microfabrication under vacuum conditions.

  • Research and Development: Supports precision experiments in physics, materials science, and advanced engineering labs.

  • High-Precision Assembly: Facilitates micromechanical assembly with reliable, smooth linear motion control.