Spruce Low-Power Nanosecond UV Laser Spruce-355-5
Description
Huaray-Spruce Low Power UV DPSS Lasers (3W/5W) is featured with compact structure design ensuring great performance and beam transmission. Especially, in mass production, still can keep very high stability and reliability, which can satisfy all kinds of industrial manufacturing even in harsh working condition. This laser is low maintenance and easy to integrate with other equipment, can save a lot of time, money and energy.
Spruce Low-Power Nanosecond UV Laser Spruce-355-5
Specifications |
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|---|---|
| Avg. Power: | 5 W |
| Wavelength: | 355 nm |
| Repetition Rate: | 20-200kHz |
| Spatial Mode (M^2): | 1.2 |
| Pulse Duration: | 20 ns |
| Pulse-to-Pulse Stability (RMS): | 3 % |
| Cooling: | Water-to-Water |
Features
- Stable output of power and pulse width
- Excellent beam quality, M²<1.2
- High beam pointing stability
- Wide repetition rate range:20-200kHz
- Controllable with RS232 interface
- Unique Intracavity frequency doubling technology.
- Triggerable external
Applications
They are widely used in 3C industry marking, white plastic and electrical enclosure tag marking. Processing on the fly in food, medical packing and various package material, removal of metal and non-metal coating, scribing for various materials, blind slot processing, as well as new ultra-thin metal foil and other microprocessing.
For pricing, technical or any other questions please contact the supplier
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- No markups, no fees
- Direct contact with supplier
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How to order?
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Ships from:
China
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Frequently Asked Questions
The wavelength of the Spruce Low-Power Nanosecond UV Laser is 355nm.
The output power of the Spruce-355-5 model is greater than 5W at 40kHz.
The polarization ratio of the laser is horizontal, greater than 100:1.
The classification of the laser is Class 4.
The laser is widely used in 3C industry marking, white plastic and electrical enclosure tag marking, processing on the fly in food and medical packing, removal of metal and non-metal coating, scribing for various materials, blind slot processing, and new ultra-thin metal foil and other microprocessing.