Poplar-355-18 Mid-Power Nanosecond UV Laser
Description
Poplar Mid-power Nanosecond Ultraviolet Laser is integrally designed as per the manufacturing requirements of world top customers, and is simple in integration and quick in delivery. The laser can achieve narrow pulse width under high frequency, and is small in machining edge heat effect and high in efficiency. Meanwhile, the frequency tripling point moving function ensures long service life, and the online monitoring function is optional to comply with the industrial machining requirements under stringent conditions.
Poplar-355-18 Mid-Power Nanosecond UV Laser
Specifications |
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|---|---|
| Avg. Power: | 18 W |
| Wavelength: | 355 nm |
| Repetition Rate: | 50-200kHz |
| Spatial Mode (M^2): | 1.2 |
| Pulse Duration: | 15 ns |
| Pulse-to-Pulse Stability (RMS): | 3 % |
| Cooling: | Water-to-Water |
Features
- Stable output of power and pulse width
- Excellent beam quality, M²<1.2
- High beam pointing stability
- Wide repetition rate range:20-200kHz
- Controllable with RS232 interface
- Unique Intracavity frequency doubling technology
- Triggerable external
Applications
This series of products is mainly applied to high-end market of ultra-precision machining, including the fields of PCB/FPCB cutting and splitting, ceramic material perforation and scribing, glass/sapphire/wafer cutting, LED substrate wafer scribing, etc.
For pricing, technical or any other questions please contact the supplier
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How to order?
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China
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Frequently Asked Questions
The wavelength of the Poplar-355-18 Mid-Power Nanosecond UV Laser is 355nm.
The output power of the Poplar-355-18 Mid-Power Nanosecond UV Laser is greater than 18W at 60kHz.
The repetition rate range of the Poplar-355-18 Mid-Power Nanosecond UV Laser is 20-200kHz.
The polarization ratio of the Poplar-355-18 Mid-Power Nanosecond UV Laser is horizontal, greater than 100:1.
The Poplar-355-18 Mid-Power Nanosecond UV Laser is mainly applied to high-end market of ultra-precision machining, including the fields of PCB/FPCB cutting and splitting, ceramic material perforation and scribing, glass/sapphire/wafer cutting, LED substrate wafer scribing, etc.