AOPico 355 6-200 Industrial Picosecond Lasers for Precision Micro-machining

Specifications

Avg. Power: 6 W
Wavelength: 355 nm
Repetition Rate: 6 – 200 kHz
Spatial Mode (M^2): 1.3
Pulse Duration: 0.007 ns
Pulse-to-Pulse Stability (RMS): 2 %
Cooling: Water-to-Water
Beam Roundness (%): >85
Beam Diameter (mm): ~1.0
Beam Diameter (mm): ~0.6
Beam Diameter (mm): ~0.5
Point Stability (µrad/ºC): <50
Polarization Ratio: 100:1 Linear, Horizontal
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Features

  • Advanced Optowave™ Diode-Pumped Solid-State Laser Solutions
  • Available Models: PICO-IR-1064, GR-532, UV-355
  • Versatile Applications: Thin-Film Ablation, Medical Device Manufacturing, Polymer Processing/Machining, Semiconductor/PV Processing/Wafer Scribing, High-Precision Micro-machining, Brittle Material Cutting, Drilling, Dicing & Sub-Surface Marking
  • Industry-Leading Cost Efficiency: Lowest Cost of Ownership
  • Exceptional Beam Quality: M2 < 1.3
  • Multiple Wavelengths Available: IR, Green, UV
  • High Power Output: Up to 45W Average Power
  • Ultra-Short Pulse Durations: 7 ps
  • Reliable Design: Highly Reliable with Burst Mode Option

Applications

  • Thin-Film Ablation
  • Medical Device Manufacturing
  • Polymer Processing/Machining
  • Semiconductor/PV Processing/Wafer Scribing
  • High-Precision, High-Speed Micro-machining
  • Brittle Material Cutting, Drilling, Dicing & Sub-Surface Marking