410-DHR Reflectometer

Specifications

Wavelength Range (reflectance): 900 – 12000 nm
Minimum Scan Time: 7 sec
Measured Parameter: Directional hemispherical reflectance (DHR)
Measured Value: Absolute reflectance (0-1)
Wavelength Bands (microns): .9-1.1, 1.9-2.4, 3.0-4.0, 3.0-5.0, 4.0-5.0, 8.0-12.0
Angle Of Incidence: 20º & 60º from normal incidence
ASTM Standards: E903
Calibration Coupon: Specular Gold
Accuracy: +/- .03
Repeatability: ±.005 units
Beam Spot Size: 0.50 inches
Measurement Time: 10 sec
Sample Size & Geometry: Flat: ≥ 0.5 in. diameter, Curved: 6 in. convex; 12 in. concave
Warm Up Time: 90 seconds
Time Between Measurements: 2 seconds
Sample Temperature: Ambient or heated/cooled to 0 - 100º C
Operating Temp: 0º to 40º C
Run Time: 2 hours on one battery
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Features


  • Portable Emissometer: Designed for field verification of optical properties of large objects.

  • Dual Angle Measurement: Measures integrated surface reflectance at 20° and 60° angles of incidence.

  • Wide Spectral Range: Covers six discrete wavelength bands from 0.9 to 12 μm.

  • Immediate Data Access: Features a touchscreen display for quick data review and management.

  • Fast Calibration: One-minute calibration at the start of each measurement session.

  • Quick Data Collection: Obtain measurements in 10 seconds or less.

  • Versatile Measurement Capability: Suitable for curved and large objects without special jigs or fixtures.

  • Optional Grazing Angle Model: Available with an 80° incident angle.

  • Portable Command Module Configuration: Built-in touchscreen and intuitive software for easy field or lab use.

  • Desktop Remote Control Unit (RCU) Configuration: Offers flexibility in operation and control.

  • Compliance: Subject to US export regulations; may require a license prior to export.

Applications


  • IR Signature Analysis: Supports defense and aerospace stealth technology verification.

  • Stealth Coatings & Low Observables: Critical for evaluating coating performance in field conditions.

  • Thermal Modeling: Provides accurate input data for simulation and analysis.

  • Thermal Camera Calibration: Ensures precision in infrared imaging systems.

  • Wafer Fabrication: Determines emissivity of semiconductor wafers in production.