Quantas-Q2HE-355: High Energy Compact Nanosecond DPSS Laser

Specifications

Avg. Power: 4 W
Wavelength: 355 nm
Repetition Rate: 0.01 – 0.1 kHz
Pulse Duration: 7 ns
Pulse-to-Pulse Stability (RMS): 0.5 %
Cooling: Air
Pulse Energy: 12-30 mJ
Beam Divergence: <1 mrad
Polarization: Linear, horizontal
Jitter (RMS): < 0.5 ns
Transmission Range: 1-95 %
Laser Head (W×L×H): 190 × 408 × 155 mm³
Controller Unit (W×L×H): 108 × 191 × 59 mm³
AC/DC Power Adapter, Typical (W×L×H): 89 × 422 × 330 mm³
Ambient Temperature: 15-30 ℃
Relative Humidity (non-condensing): 10-80 %
Mains Voltage: 90 – 230 VAC, single phase, 47 – 63 Hz
Lifetime Of Pump Diodes:: > 2 G shots

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Features

Key Features of the Q2HE High-Energy Air-Cooled Q-Switched Laser

  • High-energy pulsed laser output: Delivers up to 120 mJ pulse energy and up to 5 W average output power, making it suitable for demanding scientific, industrial, and remote sensing applications.
  • Air-cooled, water-free operation: Innovative laser crystal cooling technology eliminates the need for external chillers, cooling water, and bulky infrastructure, enabling a compact and low-maintenance setup.
  • Q-switched nanosecond performance: Produces short pulses of less than 7 ns, ideal for applications requiring high peak power such as LIBS, laser ablation, PLD, and laser shock generation.
  • Fundamental wavelength options: Available with 1053 nm or 1064 nm output wavelength for compatibility with a wide range of optics, detectors, and harmonic conversion modules.
  • Efficient harmonic generation capability: Low beam divergence and high beam quality support wavelength conversion to 2nd, 3rd, 4th, and 5th harmonics, with UV output available down to approximately 211 nm.
  • Up to 100 Hz repetition rate: Supports high-throughput operation with repetition rates up to 100 Hz, with smoothly variable pulse repetition rate available on selected 1053 nm models.
  • Compact turnkey laser system: Most laser electronics are integrated directly into the laser head, requiring only a compact controller box and mains adapter for simplified installation.
  • No bulky power supply required: Operates from a compact external adapter providing 28 VDC with model-dependent power consumption, reducing system footprint and integration complexity.
  • Long pump diode lifetime: Designed for reliable long-term operation with pump diode lifetime exceeding 2 billion shots, lowering maintenance requirements and operating cost.
  • Built-in synchronization output: Integrated sync pulse generator provides low-jitter trigger signals for timing user equipment, detectors, cameras, delay generators, and measurement systems.
  • Flexible triggering modes: Can operate in internal triggering mode or be externally triggered from a delay generator for precise synchronization in laboratory and OEM systems.
  • Remote Ethernet control: Built-in Ethernet interface and web-server allow monitoring and control from any modern web browser without installing dedicated software.
  • API for system integration: Provides an application programming interface for integration into automated instruments, OEM platforms, research setups, and industrial laser systems.
  • Optimized for LIBS applications: High pulse energy, short pulse duration, and excellent beam quality make the Q2HE well suited for Laser Induced Breakdown Spectroscopy and elemental analysis.
  • Suitable for LIDAR and remote sensing: High-energy nanosecond pulses and stable timing make it a strong choice for Light Detection and Ranging, remote sensing, and laser designation.
  • Ideal for laser ablation and marking: High peak power output supports precision laser ablation, marking, LCD repair, surface processing, and material modification.
  • Compatible with pulsed laser deposition: Provides the short-pulse, high-energy output required for Pulsed Laser Deposition of thin films and advanced materials.
  • Optional attachable 2nd harmonic generator: Enables convenient frequency doubling for applications requiring green output from the fundamental wavelength.
  • Optional stand-alone harmonic modules: Supports 2nd, 3rd, 4th, and 5th harmonic generators for visible and UV wavelength generation.
  • Optional UV optics protection: Stand-alone air purging unit is available to extend the lifetime of UV optics during harmonic operation.
  • Optional pulse energy control: Attachable attenuator is available for the fundamental wavelength, enabling convenient adjustment of output pulse energy.
  • Optional pulse energy monitoring: Attachable pulse energy monitor supports real-time energy diagnostics and process stability monitoring.
  • Optional seeder for SLM operation: Seed laser option enables single-longitudinal-mode operation for applications requiring narrow linewidth and improved spectral control.

Applications

  • Laser-Induced Breakdown Spectroscopy (LIBS): High-energy nanosecond pulses for elemental analysis, material identification, mining analysis, metallurgy, recycling, environmental monitoring, and in-situ chemical detection.
  • Light Detection and Ranging (LiDAR): Short-pulse, low-divergence laser output for range finding, atmospheric LiDAR, aerosol profiling, topographic mapping, wind sensing, and remote distance measurement.
  • Remote Sensing and Target Designation: High pulse energy and stable Q-switched operation for long-range optical sensing, laser designation, field instrumentation, and defense-oriented measurement systems.
  • Laser Ablation: Efficient material removal for precision ablation, surface modification, thin-film removal, LCD repair, semiconductor processing, microelectronics rework, and laser cleaning.
  • Laser Marking and Engraving: Nanosecond pulse performance for permanent marking, engraving, serialization, traceability codes, and high-contrast processing of metals, ceramics, glass, polymers, and coated materials.
  • Pulsed Laser Deposition (PLD): High-energy pulsed output and optional harmonic generation for thin-film deposition of oxides, nitrides, superconductors, semiconductors, transparent conductive films, and advanced research materials.
  • Laser Shock Wave Generation: Generation of high-pressure shock waves for laser shock peening, material strengthening, adhesion testing, dynamic material studies, and high-strain-rate physics experiments.
  • Nonlinear Optics and Harmonic Generation: Fundamental 1053 nm or 1064 nm output with optional 2nd, 3rd, 4th, and 5th harmonic generation for UV and deep-UV applications down to 211 nm.
  • UV Laser Processing: Frequency-converted output for micromachining, microstructuring, precision drilling, polymer processing, glass processing, and high-resolution material modification.
  • Scientific Research and Laboratory Instrumentation: Compact, air-cooled Q-switched laser source for spectroscopy, photophysics, plasma generation, nonlinear optical experiments, and university or industrial R&D laboratories.
  • Plasma Generation and Diagnostics: High peak power nanosecond pulses for laser-produced plasma studies, plasma spectroscopy, ignition experiments, and time-resolved diagnostic systems.
  • Photoacoustic Spectroscopy and Imaging: Pulsed laser excitation for photoacoustic signal generation in biomedical imaging, gas sensing, material inspection, and analytical instrumentation.
  • Laser Ultrasonics: Non-contact ultrasonic wave generation for nondestructive testing, composite inspection, weld evaluation, crack detection, and remote material characterization.
  • Pump Source for Optical Parametric Oscillators and Amplifiers: High-energy, short-pulse operation suitable for pumping OPO, OPA, dye laser, and tunable laser systems across visible, UV, and infrared wavelength ranges.
  • Time-Resolved Spectroscopy: Low-jitter triggering and nanosecond pulse duration for pump-probe experiments, fluorescence lifetime studies, transient absorption measurements, and fast optical diagnostics.
  • Mass Spectrometry and MALDI Research: UV harmonic options for laser desorption, ionization studies, analytical chemistry, bioanalysis, and advanced mass spectrometry source development.
  • Micromachining and Precision Materials Processing: Controlled pulse energy and optional attenuation for drilling, cutting, scribing, trimming, surface texturing, and selective removal of thin layers.
  • Semiconductor and Electronics Manufacturing: Laser processing for wafer repair, thin-film patterning, conductive layer removal, failure analysis, microelectronic component modification, and display panel repair.
  • High-Resolution Display and LCD Repair: Precise laser ablation for pixel repair, defect correction, metal line trimming, and display manufacturing process development.
  • Environmental Monitoring: LIBS and LiDAR-based detection of aerosols, pollutants, particulates, soil composition, water contaminants, and hazardous materials in remote or field-deployable systems.
  • Geology, Mining, and Mineral Analysis: Elemental identification and mapping of ores, rocks, soils, and mineral samples using LIBS and laser ablation techniques.
  • Forensics and Security Screening: Rapid material identification, trace residue detection, explosive detection research, and standoff analysis using laser-induced plasma and optical spectroscopy.