Quantas-Q-SHIFT-1571: High Energy ns Pulsed DPSS Laser

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Specifications

Avg. Power: 1 W
Wavelength: 1571 nm
Repetition Rate: 0.01 – 0.1 kHz
Pulse Duration: 2 ns
Pulse-to-Pulse Stability (RMS): 3.5 %
Cooling: Air
Pulse Energy: 3 to 30 mJ
Beam Divergence: 5.0 mrad
Polarization: Linear, > 95 %
Jitter (RMS): < 0.5 ns
Laser Head (W×L×H): 190 × 408 × 155 mm³
Controller Unit (W×L×H): 108 × 191 × 59 mm³
Power Adapter (W×L×H): 89 × 422 × 330 mm³
Ambient Temperature: 15-30 °C
Relative Humidity (non-condensing): 10-80 %
Mains Voltage: 90 – 230 VAC, single phase, 47 – 63 Hz
Lifetime: >2 G shots
Q-switch Type: Active
Power Drif: ± 3.0 %

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Features

  • Fundamental Wavelength Options: 1163, 1177, 1300, 1317, 1551, and 1571 nm
  • Harmonic Options: Up to 4th harmonic
  • Peak Power: Up to 30 mJ
  • Average Power: Up to 800 mW
  • Cooling: Air-cooled, water-free
  • High-speed Triggering
  • Jitter: <0.5ns RMS
  • Shot Lifetime: >2 G

Applications

Applications for Diode-Pumped Air-Cooled Q-Switched Lasers

  • Laser micromachining: Precision cutting, drilling, trimming, scribing, and patterning of metals, ceramics, glass, polymers, and thin films using high-peak-power nanosecond pulses.
  • LCD and flat-panel display repair: Pixel repair, circuit trimming, defect removal, and localized material processing for LCD, OLED, microLED, and semiconductor display manufacturing.
  • Laser ablation: Controlled removal of coatings, oxides, paints, residues, and surface layers with minimal thermal damage to the surrounding material.
  • Laser cleaning: Non-contact cleaning of precision components, optical parts, archaeological artifacts, molds, electronic assemblies, and industrial surfaces.
  • LIBS – Laser-Induced Breakdown Spectroscopy: Elemental analysis of solids, liquids, powders, metals, minerals, soils, semiconductors, and environmental samples using short, high-energy pulses.
  • Time-resolved laser spectroscopy: Pump-probe experiments, fluorescence lifetime studies, transient absorption measurements, and photochemical reaction analysis.
  • LiDAR and range finding: Eye-safe and near-infrared light detection and ranging, atmospheric sensing, remote distance measurement, target designation, and 3D mapping applications.
  • Scientific research: Laboratory light source for nonlinear optics, photophysics, laser-material interaction studies, plasma generation, and advanced optical experiments.
  • Nonlinear optics and harmonic generation: Generation of visible, ultraviolet, and near-infrared wavelengths through second, third, and fourth harmonic conversion for specialized research and industrial use.
  • Optical parametric generation and wavelength conversion: Pump source for nonlinear wavelength conversion systems requiring nanosecond pulses and high peak intensity.
  • Semiconductor processing: Wafer marking, micro-structuring, thin-film removal, defect repair, mask repair, and precision ablation in semiconductor and microelectronics manufacturing.
  • Photovoltaic and solar cell processing: Scribing, edge isolation, thin-film patterning, and laser processing of solar cell materials and coatings.
  • Medical and dermatology research: Research and development for laser dermatology techniques including skin resurfacing, tattoo pigment interaction studies, acne treatment research, and hair removal technology development.
  • Biomedical instrumentation: Excitation source for fluorescence systems, photoacoustic imaging research, tissue interaction studies, and biosensing platforms.
  • Photoacoustic spectroscopy and imaging: Pulsed laser excitation for acoustic wave generation in biomedical, gas sensing, materials analysis, and nondestructive testing applications.
  • Laser-induced fluorescence: Excitation of fluorescent markers, dyes, biological samples, minerals, and chemical compounds for analytical and imaging applications.
  • Raman spectroscopy: Pulsed laser excitation for material identification, molecular analysis, chemical sensing, and research-grade spectroscopy systems.
  • Mass spectrometry sample ionization: Laser desorption, laser ablation, and ionization source for analytical chemistry, materials science, and bioanalytical research.
  • MALDI and LDI research: Pulsed UV or visible laser source for matrix-assisted laser desorption ionization and laser desorption ionization development.
  • Laser marking and engraving: High-contrast marking of metals, plastics, ceramics, glass, coated materials, electronic parts, tools, and industrial components.
  • Precision trimming of electronic components: Resistor trimming, capacitor tuning, sensor calibration, and microelectronic circuit adjustment.
  • Glass and transparent material processing: Surface modification, micro-crack initiation, internal marking, and precision ablation of glass and optical materials.
  • Ceramic and hard-material machining: Micro-drilling, engraving, and surface structuring of alumina, sapphire, silicon carbide, and other hard technical materials.
  • Thin-film processing: Selective removal, patterning, and structuring of optical coatings, conductive films, dielectric layers, and multilayer materials.
  • Optics manufacturing: Optical coating repair, alignment, damage threshold testing, component inspection, and precision laser processing of optical assemblies.