Specifications

Avg. Power: 3 W
Wavelength: 355 nm
Repetition Rate: 0.001 – 8000 kHz
Spatial Mode (M^2): 1.3
Pulse Duration: 0.05 ns
Pulse-to-Pulse Stability (RMS): 2 %
Cooling: Water-to-Water, Water-to-Air, Air
Document icon Download Data Sheet Download icon

Features


  • High Power Output: Up to 100W of power at 1064nm.

  • Pulse Energy: Up to 3mJ of pulse energy at 1064nm.

  • Sub-nanosecond Pulse Width: Specifiable from ~50ps to 5ns.

  • Versatile Repetition Rate: From single shot to 8MHz.

  • Excellent Beam Quality: M2 < 1.3.

  • Cooling Options: Available in air-cooled and closed-loop chilled versions.

  • Compact Design: Small, compact all-in-one form factor.

  • Advanced Technology: Diode-pumped technology.

  • Harmonic Options: Available for 532nm and 355nm wavelengths.

  • Low Jitter: Less than 500ps.

  • Burst Mode: Available for enhanced performance.


 

Applications


  • Glass and Sapphire Processing: Cutting, drilling, and scribing for display and optical components

  • Semiconductor Manufacturing: Scribing, dicing, and thin-film removal

  • Electronics and PCB Fabrication: Precision structuring and drilling

  • Solar Cell Production: High-efficiency scribing and drilling processes

  • Medical Device Manufacturing: Micromachining for cutting, drilling, and marking

  • Advanced Materials Processing: Metals, ceramics, composites, and carbon fiber

  • Emerging Technologies: 3D LiDAR, ink-jet nozzle drilling, and nanotexturing