AOPico 532 5-100 Industrial Picosecond Lasers for Precision Micro-machining

Specifications

Avg. Power: 5 W
Wavelength: 532 nm
Repetition Rate: 1 – 100 kHz
Spatial Mode (M^2): 1.3
Pulse Duration: 0.007 ns
Pulse-to-Pulse Stability (RMS): 2 %
Cooling: Water-to-Water
Energy (µJ): 100
Beam Quality (M2): <1.3
Beam Roundness (%): >85
Beam Diameter (mm): ~1.0
Beam Divergence (mRad): <0.7
Point Stability (µrad/ºC): <50
Polarization Ratio: 100:1 Linear, Horizontal
Polarization Ratio: 100:1 Linear, Vertical
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Features

  • Advanced Optowave™ Diode-Pumped Solid-State Laser Solutions: Providing cutting-edge technology for industrial applications.
  • Versatile Wavelength Options: Available in IR (1064 nm), Green (532 nm), and UV (355 nm) to suit diverse industrial needs.
  • High Average Power: Offers up to 45W average power for demanding applications.
  • Ultra-Short Pulse Durations: 7 ps pulse durations for precision micro-machining.
  • Excellent Beam Quality: M2 < 1.3 ensures superior beam performance.
  • Highly Reliable Design: Engineered for durability and consistent performance.
  • Burst Mode Option: Enhance processing capabilities with burst mode functionality.
  • Wide Range of Applications: Ideal for thin-film ablation, medical device manufacturing, polymer processing, semiconductor processing, wafer scribing, and more.
  • Efficient and Cost-Effective: Lowest cost of ownership in the industry.
  • Compliance and Safety: Meets CDRH, ROHS, and CE compliance standards.
  • Compact and Lightweight Design: Laser head dimensions of 25 x 15 x 7 in (585 x 381 x 179 mm) and weight of 70 lbs (32 kg).
  • Easy Integration: RS-232 communication and water cooling for seamless operation.
  • Robust Environmental Specifications: Operational temperature range of 15 to 30°C and storage temperature range of -20 to 50°C.
  • Flexible Power Requirements: Input voltage range of 90 to 260 VAC and line frequency of 50 or 60 Hz.

Applications

  • Thin-Film Ablation
  • Medical Device Manufacturing
  • Polymer Processing/Machining
  • Semiconductor/PV Processing/Wafer Scribing
  • High-Precision, High-Speed Micro-machining
  • Brittle Material Cutting, Drilling, Dicing & Sub-Surface Marking