AOPico 532 12-200 Industrial Picosecond Lasers for Precision Micro-machining

Specifications

Avg. Power: 12 W
Wavelength: 532 nm
Repetition Rate: 1 – 200 kHz
Spatial Mode (M^2): 1.3
Pulse Duration: 0.007 ns
Pulse-to-Pulse Stability (RMS): 2 %
Cooling: Water-to-Water
Average Power: 45 W
Energy: 125 µJ
Specified Repetition Rate: 1000 kHz
Beam Roundness: >85%
Beam Diameter: ~0.5 mm
Beam Divergence: <0.35 mRad
Point Stability: <50 µrad/ºC
Polarization Ratio: 100:1 Linear, Horizontal
Operational Temperature Range: 15 to 30 ºC
Storage Temperature Range: -20 to 50 ºC
Input Voltage: 90 to 260 VAC
Laser Head Dimensions: 25 x 15 x 7 in (585 x 381 x 179 mm)
Laser Head Weight: 70 lbs (32 kg)
Laser Controller Dimensions: 19 x 17 x 7 in (482 x 432 x 178 mm)
Laser Controller Weight: 30 lbs (13.6 kg)
Document icon Download Data Sheet Download icon

Features


  • Industrial Picosecond Lasers: The AOPicoTM Series offers advanced picosecond laser technology for industrial applications.

  • Advanced OptowaveTM Solutions: Utilizing diode-pumped solid-state laser solutions for superior performance.

  • Versatile Wavelength Options: Available in IR (1064 nm), Green (532 nm), and UV (355 nm) wavelengths to suit diverse applications.

  • High Power Output: Delivers up to 45W of average power for demanding tasks.

  • Precision Pulse Duration: Offers pulse durations of just 7 picoseconds for high-precision applications.

  • Exceptional Beam Quality: Beam quality of M2 < 1.3 ensures excellent performance.

  • Cost-Effective Operation: Designed to provide the lowest cost of ownership in the industry.

  • Reliable and Robust Design: Engineered for high reliability and consistent performance.

  • Burst Mode Option: Includes a burst mode for enhanced application flexibility.

  • Wide Range of Applications: Ideal for thin-film ablation, medical device manufacturing, polymer processing/machining, semiconductor/PV processing, wafer scribing, high-precision micro-machining, and brittle material cutting, drilling, dicing, and sub-surface marking.

  • Stable and Accurate: Features pulse-to-pulse stability of <2% RMS and average power stability of <3% over 12 hours.

  • Operational Flexibility: Operates within a temperature range of 15 to 30ºC and humidity range of 20 to 80% non-condensing.

  • Compliance and Safety: Meets CDRH, ROHS, and CE compliance standards.

  • Convenient Communication and Cooling: Equipped with RS-232 communication and water cooling for optimal performance.

Applications


  • Thin-Film Ablation

  • Medical Device Manufacturing

  • Polymer Processing/Machining

  • Semiconductor/PV Processing/Wafer Scribing

  • High-Precision, High-Speed Micro-machining

  • Brittle Material Cutting, Drilling, Dicing & Sub-Surface Marking