AONano 532-6W-20K ND:YAG GR Laser

Specifications

Avg. Power: 6 W
Wavelength: 532 nm
Repetition Rate: 1 – 50 kHz
Spatial Mode (M^2): 1.2
Pulse Duration: 20 ns
Pulse-to-Pulse Stability (RMS): 2 %
Cooling: Air
Pulse Repetition Rate: Single Shot to 300 kHz
Spatial Mode: TEM00
Beam Roundness: >90%
Pulse Energy (mJ @ 1kHz): >300uJ
Polarization Ratio: >100:1 LINEAR, VERTICAL
Communication Protocol: RS-232
Operating Voltage (VAC): 90-260
Line Frequency (Hz): 47-63
Operation Temperature: 15º - 30º C
Storage Temperature: -20º - 50º C
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Features


  • Innovative End-Pumping Technology: Enhances efficiency and performance in industrial laser applications.

  • Air-Cooling: Supports average power up to 10W, ensuring efficient heat management.

  • Excellent Beam Quality, Pulse Stability & Point Stability: Guarantees precise and consistent laser output.

  • Patent Pending Harmonic Conversion Technologies: Offers advanced laser capabilities and improved conversion efficiency.

  • Ultra-Compact & Light-Weight Design: Facilitates easy integration into various industrial setups.

  • Brand-New Focusing Optics: Provides superior focusing capabilities for enhanced laser precision.

  • Field-Replaceable Diode: Simplifies maintenance and reduces downtime with easy diode replacement.

  • 24/7 Proven Reliability: Engineered to perform reliably in demanding production environments.

  • Low Operational Cost: Designed for cost-effective operation and maintenance.

  • Flexible Laser Architectures: Customizable to meet specific laser requirements beyond standard specifications.

  • Wide Pulse Frequency Range: Ranges from 1-300 kHz, with optional extension to 1 MHz.

  • High Pulse Energy: Delivers pulse energy in excess of 10mJ for powerful laser applications.

  • Sealed Laser Head: Ensures long-term reliability by protecting the laser head in a clean room environment.

  • Comprehensive Warranty: Limited warranty coverage provided for all AWAVE Series laser systems.

Applications


  • Precision Micromachining: Perfect for fine cutting, drilling, and patterning of metals and non-metals.

  • Semiconductor Processing: Supports wafer dicing, marking, and scribing with high repeatability.

  • Medical Device Manufacturing: Ensures clean, precise laser structuring of medical-grade materials.

  • Solar & Photovoltaic Production: Delivers consistent laser performance for scribing and patterning.

  • Advanced Research & Development: Suitable for laboratories requiring customizable, high-stability lasers.