AONano 355-4W-30K ND:YV04 UV Laser

Specifications

Avg. Power: 4 W
Wavelength: 355 nm
Repetition Rate: 1 – 300 kHz
Spatial Mode (M^2): 1.2
Pulse Duration: 15 ns
Pulse-to-Pulse Stability (RMS): 2 %
Cooling: Air
Spatial Mode: TEM00
Beam Roundness: >90%
Pulse Width (ns) @ 1kHz: <40ns
Pulse Energy (mJ @ 1kHz): >0.2mJ
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Features


  • Innovative End-Pumping Technology: Enhances efficiency and performance for demanding applications.

  • Air-Cooling (Average Power Up to 6W): Ensures optimal operation without the need for complex cooling systems.

  • Excellent Beam Quality, Pulse Stability & Point Stability: Delivers precision and reliability in laser applications.

  • Patent Pending Harmonic Conversion Technologies: Offers cutting-edge solutions for enhanced laser performance.

  • Ultra-Compact & Light-Weight: Designed for easy integration and portability.

  • Brand-New Focusing Optics: Provides superior focusing capabilities for precise applications.

  • Field-Replaceable Diode: Simplifies maintenance and reduces downtime with easy diode replacement.

  • 24/7 Proven Reliability: Engineered for continuous operation in industrial environments.

  • Low Operational Cost: Economical solution with reduced energy consumption and maintenance needs.

  • Wide Pulse Frequency Range: From 1-300 kHz, with options up to 500 kHz for versatile application requirements.

  • Flexible Laser Architectures: Customizable to meet specific industrial needs and specifications.

  • Sealed Laser Head: Ensures long-term reliability by protecting components in a clean room environment.


 

Applications


  • Micromachining: Precision processing of small components in electronics and medical devices.

  • Semiconductor Manufacturing: Used in the production and processing of semiconductor wafers.

  • PCB Drilling: High precision drilling of printed circuit boards for electronic devices.

  • Surface Texturing: Creating specific surface patterns for improved material properties.

  • Thin Film Patterning: Used in the production of solar cells and display technologies.

  • Laser Marking: Permanent marking of materials for traceability and branding.

  • Medical Device Manufacturing: Precision cutting and shaping of medical components.

  • Glass Cutting and Engraving: High precision cutting and engraving of glass products.

  • Solar Cell Processing: Used in the manufacturing and efficiency enhancement of solar cells.

  • Research and Development: Utilized in scientific research for developing new materials and technologies.