AONano 355-15W-30K ND:YV04 UV Laser

Specifications

Avg. Power: 15 W
Wavelength: 355 nm
Repetition Rate: 1 – 300 kHz
Spatial Mode (M^2): 1.2
Pulse Duration: 15 ns
Pulse-to-Pulse Stability (RMS): 2 %
Cooling: Water-to-Water
Pulse Repetition Rate: Single Shot to 20 kHz
Spatial Mode: TEM00
Beam Roundness: >90%
Pulse Width (ns): <40ns @1kHz
Pulse Width (ns): <70ns @10kHz
Pulse Energy (mJ @ 1kHz): >0.2mJ
Pulse Energy (mJ @ 1kHz): >0.4mJ
Pulse Energy (mJ @ 1kHz): >0.8mJ
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Features


  • Innovative End-Pumping Technology: Provides enhanced performance and efficiency for demanding applications.

  • Air-Cooling (Average Power Up to 6W): Efficient cooling system ensures optimal performance and reliability.

  • Excellent Beam Quality, Pulse Stability & Point Stability: Delivers precise and consistent results for various industrial applications.

  • Patent Pending Harmonic Conversion Technologies: Offers advanced capabilities for superior laser processing.

  • Ultra-Compact & Light-Weight: Easy to integrate into existing systems, saving space and reducing weight.

  • Brand-New Focusing Optics: Enhances precision and accuracy in laser applications.

  • Field-Replaceable Diode: Simplifies maintenance and reduces downtime with easy diode replacement.

  • 24/7 Proven Reliability: Engineered for continuous operation in demanding production environments.

  • Low Operational Cost: Cost-effective design reduces overall expenses while maintaining high performance.

  • Flexible Laser Architectures: Customizable to meet specific requirements beyond standard specifications.


 

Applications


  • Precision Micromachining: Ideal for applications requiring high precision and minimal thermal impact.

  • PCB Drilling and Cutting: Suitable for drilling and cutting printed circuit boards with high accuracy.

  • Semiconductor Processing: Utilized in wafer dicing and other semiconductor manufacturing processes.

  • Medical Device Manufacturing: Enables precise cutting and shaping of medical devices and components.

  • Glass and Sapphire Cutting: Effective for cutting and scribing glass and sapphire materials.

  • Thin Film Patterning: Used in the patterning of thin films for various electronic applications.

  • Solar Cell Processing: Facilitates the processing of solar cells, including edge isolation and drilling.

  • LED Manufacturing: Applied in the fabrication and processing of LED components.

  • Marking and Engraving: Provides high-quality marking and engraving on a variety of materials.

  • Scientific Research: Supports various research applications requiring precise laser technology.