AONano 355-1.5W-20K ND:YV04 UV Laser

Specifications

Avg. Power: 1.5 W
Wavelength: 355 nm
Repetition Rate: 1 – 300 kHz
Spatial Mode (M^2): 1.2
Pulse Duration: 20 ns
Pulse-to-Pulse Stability (RMS): 2 %
Cooling: Air
Spatial Mode: TEM00
Beam Roundness: >90%
Pulse Width (ns): <40ns @1kHz
Pulse Energy (mJ @ 1kHz): >0.8mJ
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Features


  • Innovative End-Pumping Technology: Ensures efficient energy transfer and superior performance in demanding environments.

  • Air-Cooling (Average Power Up to 6W): Provides optimal cooling, maintaining performance while minimizing maintenance needs.

  • Excellent Beam Quality, Pulse Stability & Point Stability: Guarantees precision and consistency for high-quality results.

  • Patent Pending Harmonic Conversion Technologies: Enhances laser capabilities, offering advanced functionality.

  • Ultra-Compact & Light-Weight: Easy to integrate into various production setups, saving space and reducing installation complexity.

  • Brand-New Focusing Optics: Delivers superior focusing capabilities for enhanced laser performance.

  • Field-Replaceable Diode: Simplifies maintenance and reduces downtime, ensuring continuous operation.

  • 24/7 Proven Reliability: Designed for continuous operation in demanding production environments, offering dependable performance.

  • Low Operational Cost: Efficient design minimizes energy consumption and maintenance costs, providing long-term savings.

  • Flexible Laser Architectures: Customizable solutions to meet specific application requirements.

Applications


  • Micromachining: Achieve precise and intricate designs on small-scale materials.

  • Laser Marking: Create permanent marks on various materials with high precision.

  • Semiconductor Processing: Enhance the production of semiconductor devices with precision laser applications.

  • Medical Device Manufacturing: Facilitate the creation of medical devices with high accuracy and reliability.

  • Electronics Manufacturing: Improve the production of electronic components through precise laser technology.

  • Thin Film Patterning: Accurately pattern thin films for various industrial applications.

  • Research and Development: Support innovative research with advanced laser technology for experimental applications.

  • 3D Printing: Enhance 3D printing processes with precise laser sintering and cutting.

  • Non-Contact Material Processing: Perform material processing without physical contact, reducing wear and tear.

  • High-Precision Cutting: Achieve fine cuts on materials with superior edge quality.