AONano 355-12W-30K ND:YV04 UV Laser

Specifications

Avg. Power: 12 W
Wavelength: 355 nm
Repetition Rate: 1 – 300 kHz
Spatial Mode (M^2): 1.2
Pulse Duration: 15 ns
Pulse-to-Pulse Stability (RMS): 2 %
Cooling: Water-to-Water
Pulse Repetition Rate: Single Shot to 20 kHz
Spatial Mode: TEM00
Beam Roundness: >90%
Pulse Width (ns): <40ns @1kHz
Pulse Width (ns): <70ns @10kHz
Pulse Width (ns): <30ns @1kHz
Pulse Width (ns): <60ns @10kHz
Pulse Energy (mJ @ 1kHz): >0.2mJ
Pulse Energy (mJ @ 1kHz): >0.4mJ
Pulse Energy (mJ @ 1kHz): >0.8mJ
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Features


  • Innovative End-Pumping Technology: Provides efficient laser operation with enhanced performance.

  • Air-Cooling (Average Power Up to 6W): Ensures optimal temperature control and consistent power output.

  • Excellent Beam Quality, Pulse Stability & Point Stability: Delivers precise and reliable results for demanding applications.

  • Patent Pending Harmonic Conversion Technologies: Offers advanced conversion techniques for improved laser efficiency.

  • Ultra-Compact & Light-Weight: Designed for easy integration and mobility in various industrial settings.

  • Brand-New Focusing Optics: Enhances laser precision and focus for superior performance.

  • Field-Replaceable Diode: Allows for quick and easy maintenance, reducing downtime.

  • 24/7 Proven Reliability: Engineered to withstand continuous operation in production environments.

  • Low Operational Cost: Provides cost-effective laser solutions without compromising on quality.

  • Flexible Laser Architectures: Tailored designs to meet specific application requirements.

  • Wide Pulse Frequency Range: Offers pulse frequencies from 1-300 kHz, with options up to 500 kHz.

  • Broad Power and Energy Range: Covers average power from 100mW to 15W and pulse energy exceeding 4mJ.

Applications


  • Microelectronics Manufacturing: Ideal for precision tasks such as wafer dicing, scribing, and cutting due to its excellent beam quality and pulse stability.

  • Semiconductor Processing: Useful for photolithography and other semiconductor fabrication processes, thanks to its high pulse energy and stability.

  • Medical Device Fabrication: Suitable for precise cutting and drilling of medical components, leveraging its ultra-compact and lightweight design.

  • Automotive Industry: Effective for marking and engraving automotive components, ensuring durability and precision.

  • Solar Cell Production: Enhances the efficiency of solar cell manufacturing through precise material processing capabilities.

  • Research and Development: Provides a versatile tool for various R&D applications, especially where high precision and reliability are required.

  • Textile Industry: Useful for intricate cutting and engraving of fabrics, benefiting from its low operational cost and 24/7 reliability.

  • Jewelry Manufacturing: Perfect for detailed engraving and cutting of precious metals and gemstones.

  • Plastic Welding and Cutting: Offers precision and efficiency in processing plastic materials, supported by its innovative end-pumping technology.

  • Packaging Industry: Enables high-speed marking and coding on packaging materials, facilitated by its high pulse repetition rate.