AONano 355-0.5W-6K ND:YAG UV Laser

Specifications

Avg. Power: 0.5 W
Wavelength: 355 nm
Repetition Rate: 1 – 20 kHz
Spatial Mode (M^2): 1.2
Pulse Duration: 30 ns
Pulse-to-Pulse Stability (RMS): 2 %
Cooling: Air
Beam Quality (M^2): <1.2
Spatial Mode: TEM00
Beam Roundness: >90%
Pulse Width (ns): <40ns @1kHz
Pulse Energy (mJ @ 1kHz): >0.8mJ
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Features

  • Innovative End-Pumping Technology: Experience enhanced performance with our state-of-the-art end-pumping technology.
  • Air-Cooling (Average Power Up to 6W): Efficient air-cooling mechanism supports power levels up to 6W, ensuring optimal operation.
  • Excellent Beam Quality, Pulse Stability & Point Stability: Achieve superior precision and consistency with excellent beam quality and stability.
  • Patent Pending Harmonic Conversion Technologies: Leverage cutting-edge harmonic conversion for advanced laser applications.
  • Ultra-Compact & Light-Weight: Benefit from easy integration and handling with our compact and lightweight design.
  • Brand-New Focusing Optics: Enhanced focusing optics for improved performance and accuracy.
  • Field-Replaceable Diode: Simplify maintenance with easily replaceable diodes located in the laser controller.
  • 24/7 Proven Reliability: Designed for continuous operation, ideal for demanding production environments.
  • Low Operational Cost: Reduce expenses with efficient operation and maintenance.

Applications

  • Micromachining: Precise material removal for small-scale applications.
  • PCB Drilling and Cutting: Ideal for creating and shaping printed circuit boards.
  • Semiconductor Processing: Utilized in the manufacturing and processing of semiconductor devices.
  • Thin Film Patterning: Used for accurate patterning of thin films in various applications.
  • Solar Cell Scribing: Effective in scribing for solar cell production.
  • Medical Device Manufacturing: Suitable for precision cutting and shaping of medical devices.
  • Glass and Ceramic Processing: Capable of processing fragile materials like glass and ceramics without causing damage.
  • Marking and Engraving: High-quality marking and engraving on various materials.
  • Research and Development: Essential for experimental and development tasks in laboratories.
  • Laser Direct Imaging: Used in the production of high-resolution images directly onto substrates.