AONano 351-2W-3K ND:YLF UV Laser

Specifications

Avg. Power: 2 W
Wavelength: 351 nm
Repetition Rate: 1 – 20 kHz
Spatial Mode (M^2): 1.2
Pulse Duration: 30 ns
Pulse-to-Pulse Stability (RMS): 2 %
Cooling: Air
Spatial Mode: TEM00
Beam Roundness: >90%
Pulse Width (ns): <70ns @10kHz
Pulse Energy (mJ @ 1kHz): >0.8mJ
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Features


  • Innovative End-Pumping Technology: Ensures high efficiency and precision in laser operations.

  • Air-Cooling (Average Power Up to 6W): Provides efficient cooling for continuous operation without the need for complex liquid cooling systems.

  • Excellent Beam Quality, Pulse Stability & Point Stability: Delivers superior performance in demanding applications with consistent output.

  • Patent Pending Harmonic Conversion Technologies: Enhances the versatility and functionality of the laser systems.

  • Ultra-Compact & Light-Weight: Designed for easy integration into existing systems and portability.

  • Brand-New Focusing Optics: Offers precise and accurate laser focusing for improved results.

  • Field-Replaceable Diode: Simplifies maintenance and reduces downtime with easy replacement.

  • 24/7 Proven Reliability: Engineered for continuous operation in production environments, ensuring consistent performance.

  • Low Operational Cost: Designed to minimize energy consumption and maintenance costs, providing economic benefits.

  • Flexible Laser Architectures: Customizable to meet specific application requirements, enhancing adaptability for various uses.

Applications


  • Microelectronics Manufacturing: Ideal for processes such as wafer scribing, circuit repair, and thin film patterning.

  • Semiconductor Processing: Used in dicing, drilling, and marking of semiconductor materials.

  • Medical Device Manufacturing: Precise laser cutting and structuring for medical devices and components.

  • Solar Cell Production: Efficient for edge isolation, laser grooving, and patterning in solar cell manufacturing.

  • Display Technology: Utilized in the production of LCD, OLED, and other display technologies for tasks like glass cutting and patterning.

  • Automotive Industry: Laser marking and micro-machining of automotive components for enhanced precision and quality.

  • Research and Development: Suitable for scientific research applications requiring high precision and stability.

  • Material Processing: Effective for laser ablation, surface treatment, and microstructuring of various materials.

  • Jewelry and Watchmaking: Precision engraving and cutting for intricate designs and detailed craftsmanship.

  • Textile and Fashion Industry: Laser cutting and engraving for detailed patterns and designs on fabrics and textiles.