AONano 351-1W-3K ND:YLF UV Laser

Specifications

Avg. Power: 1 W
Wavelength: 351 nm
Repetition Rate: 1 – 20 kHz
Spatial Mode (M^2): 1.2
Pulse Duration: 30 ns
Pulse-to-Pulse Stability (RMS): 2 %
Cooling: Air
Wavelength: 351 nm
Average Power: 0.5W, 1W, 2W, 3W, 6W
Spatial Mode: TEM00
Beam Roundness: >90%
Pulse Width (ns): <40ns @1kHz, <70ns @10kHz, <30ns @1kHz, <60ns @10kHz
Pulse Energy (mJ @ 1kHz): >0.2mJ, >0.4mJ, >0.8mJ
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Features

  • Innovative End-Pumping Technology: Ensures high efficiency and stable performance for demanding industrial applications.
  • Air-Cooling (Average Power Up to 6W): Provides effective cooling with minimal maintenance, enhancing operational reliability.
  • Excellent Beam Quality, Pulse Stability & Point Stability: Delivers precise and consistent results, crucial for high-precision tasks.
  • Patent Pending Harmonic Conversion Technologies: Offers advanced capabilities for enhanced laser performance and versatility.
  • Ultra-Compact & Light-Weight: Facilitates easy integration into various systems and applications, saving space and reducing load.
  • Brand-New Focusing Optics: Optimizes laser focus for improved accuracy and efficiency in diverse applications.
  • Field-Replaceable Diode: Simplifies maintenance and reduces downtime with easy diode replacement.
  • 24/7 Proven Reliability: Designed for continuous operation in rigorous production environments, ensuring uninterrupted performance.
  • Low Operational Cost: Minimizes expenses with energy-efficient design and low maintenance requirements.
  • Q-Switched TEM00 Mode Lasers: Engineered for precision and reliability, ideal for high-demand industrial settings.
  • Pulse Frequencies from 1-300 kHz (up to 500 kHz optional): Offers flexibility to meet various application needs.
  • Average Power Range from 100mW to 15W: Provides a wide power range to suit different industrial requirements.
  • Pulse Energy in Excess of 4mJ: Delivers high energy output for demanding tasks.
  • Sealed Laser Head: Ensures long-term reliability by protecting components in a clean environment.

Applications

  • Micromachining: Precision machining of small components with high accuracy.
  • PCB Drilling and Cutting: Efficient processing of printed circuit boards.
  • Semiconductor Manufacturing: Used in processes such as wafer dicing and scribing.
  • Medical Device Manufacturing: Fabrication and structuring of medical devices.
  • Thin Film Removal: Effective ablation of thin film layers in various industries.
  • Marking and Engraving: High-quality marking on metals and plastics.
  • Material Processing: Suitable for a range of materials including metals, ceramics, and polymers.
  • Research and Development: Ideal for experimental setups and prototyping.
  • 3D Printing: Enhances precision in additive manufacturing processes.
  • Automotive Industry: Used for marking and cutting automotive components.