AONano 351-0.5W-3K ND:YLF UV Laser

Specifications

Avg. Power: 0.5 W
Wavelength: 351 nm
Repetition Rate: 1 – 20 kHz
Spatial Mode (M^2): 1.2
Pulse Duration: 40 ns
Pulse-to-Pulse Stability (RMS): 2 %
Cooling: Air
Average Power: 0.5W to 6W
Spatial Mode: TEM00
Beam Roundness: >90%
Pulse Width (ns): <40ns to <70ns
Pulse Energy (mJ @ 1kHz): >0.2mJ to >0.8mJ
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Features

  • Innovative End-Pumping Technology: Ensures enhanced efficiency and performance, making it ideal for demanding industrial applications.
  • Air-Cooling (Average Power Up to 6W): Provides effective cooling, maintaining optimal operational conditions while delivering up to 6W of average power.
  • Excellent Beam Quality, Pulse Stability & Point Stability: Guarantees high precision and reliability, crucial for intricate tasks and consistent results.
  • Patent Pending Harmonic Conversion Technologies: Offers cutting-edge solutions for improved laser performance and versatility.
  • Ultra-Compact & Lightweight: Facilitates easy integration and handling, saving space in production environments.
  • Brand-New Focusing Optics: Delivers superior focus and accuracy, enhancing the effectiveness of laser applications.
  • Field-Replaceable Diode: Simplifies maintenance and reduces downtime, ensuring continuous operation and efficiency.
  • 24/7 Proven Reliability: Designed to withstand continuous use, perfect for round-the-clock production environments.
  • Low Operational Cost: Offers cost-effective operation, reducing expenses while maintaining high performance.
  • Flexible Pulse Frequencies: Features pulse frequencies ranging from 1-300 kHz, with optional extension up to 500 kHz, catering to various application needs.
  • Customizable Average Power and Pulse Energy: Supports average power from 100mW to 15W and pulse energy exceeding 4mJ, with options for higher specifications.
  • Sealed Laser Head: Ensures long-term reliability by protecting internal components from contaminants.
  • Fiber-Coupled Pumping Diodes: Located in the laser controller for easy replacement, enhancing serviceability.

Applications

  • Micromachining: Ideal for precision micromachining applications requiring high beam quality and stability.
  • Semiconductor Processing: Used in semiconductor manufacturing for processes like wafer dicing and scribing.
  • PCB Manufacturing: Suitable for PCB drilling and cutting with high precision.
  • Medical Device Fabrication: Used in the production of medical devices where precise and clean cuts are necessary.
  • Glass and Ceramic Cutting: Effective for cutting and engraving glass and ceramics with minimal thermal impact.
  • Surface Treatment: Utilized for surface structuring and texturing in various materials.
  • Marking and Engraving: Provides high-quality marking and engraving on metals and plastics.
  • Scientific Research: Used in research environments for experiments requiring reliable laser performance.
  • Display Manufacturing: Applied in the production of displays, including OLED and LCD technologies.
  • Solar Cell Production: Supports processes in the manufacturing of solar cells, enhancing efficiency and precision.