AOFemto 515nm 1W DPSS Laser

Specifications

Avg. Power: 1 W
Wavelength: 515 nm
Repetition Rate: 1 – 100 kHz
Spatial Mode (M^2): 1.3
Pulse Duration: 0.0008 ns
Pulse-to-Pulse Stability (RMS): 2 %
Cooling: Water-to-Water
Energy: 20 µJ
Repetition Rate: Single Shot to 1000 kHz
Beam Quality (M2): <1.3
Beam Roundness: >85%
Beam Diameter: 2.0 mm
Point Stability: <20 µrad/ºC
Polarization Ratio: 100:1 Linear, Vertical
Polarization Ratio: 100:1 Linear, Horizontal
Pulse-to-Pulse Stability: <2% RMS
Operational Temperature Range: 15 to 30 ºC
Storage Temperature Range: -20 to 50 ºC
Input Voltage: 90 to 260 VAC
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Features

  • Lowest Cost of Ownership: Benefit from the most economical solution in the industry.
  • Excellent Beam Quality: M2 < 1.3 for superior precision.
  • Versatile Wavelength Options: Available in IR, Green, and UV.
  • High Average Power: Up to 15W for demanding applications.
  • Ultra-Short Pulse Durations: Less than 800 femtoseconds for high-speed processing.
  • Reliable Design: Engineered for durability and consistent performance.
  • Burst Mode Option: Enhanced flexibility for various applications.
  • Advanced Applications: Ideal for injector drilling, medical device manufacturing, polymer processing/machining, semiconductor/PV processing/wafer scribing, and high-precision micro-machining.
  • Brittle Material Processing: Effective for cutting, drilling, dicing, and sub-surface marking.
  • Compliance: Meets CDRH, ROHS, and CE standards.
  • Robust Communication: RS-232 interface for seamless integration.
  • Efficient Cooling: Water-cooled system for optimal thermal management.
  • Wide Operational Range: Functions effectively in temperatures from 15 to 30°C and humidity levels from 20 to 80% (non-condensing).
  • Convenient Storage Conditions: Storage temperature range from -20 to 50°C.
  • Flexible Power Input: Compatible with 90 to 260 VAC, 50 or 60 Hz.

Applications

  • Injector Drilling
  • Medical Device Manufacturing
  • Polymer Processing/Machining
  • Semiconductor/PV Processing/Wafer Scribing
  • High-Precision, High-Speed Micro-machining
  • Brittle Material Cutting, Drilling, Dicing & Sub-Surface Marking