AOFemto 515nm 10W DPSS Laser

Specifications

Avg. Power: 10 W
Wavelength: 515 nm
Repetition Rate: 100 – 200 kHz
Spatial Mode (M^2): 1.3
Pulse Duration: 0.0008 ns
Pulse-to-Pulse Stability (RMS): 2 %
Cooling: Water-to-Water
Average Power: Up to 15W
Wavelength (nm): 515
Average Power (Watts): 2
Average Power (Watts): 20
Energy (µJ): 20
Energy (µJ): 100
Repetition Rate (kHz): Single Shot to 1000
Beam Roundness (%): >85
Beam Diameter (mm): 2.0
Beam Divergence (mRad): <1.3
Point Stability (µrad/ºC): <20
Polarization Ratio: 100:1 Linear, Vertical
Pulse-to-Pulse Stability (% RMS): <2
Average Power Stability (% Over 12 Hours): <3
Operational Temperature Range (ºC): 15 to 30
Storage Temperature Range (ºC): -20 to 50
Input Voltage (VAC): 90 to 260
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Features


  • Lowest Cost of Ownership in the Industry: Designed to provide exceptional value and reduce operational expenses.

  • Excellent Beam Quality: M2 < 1.3, ensuring precision in applications.

  • Multiple Wavelength Options: Available in IR, Green, and UV to suit diverse industrial needs.

  • High Average Power: Delivers up to 15W, supporting high-speed operations.

  • Ultra-Short Pulse Durations: Pulse durations of less than 800 fs for precision micro-machining.

  • Highly Reliable Design: Engineered for durability and consistent performance.

  • Burst Mode Option: Enhances flexibility and control in various applications.

  • Versatile Applications: Ideal for injector drilling, medical device manufacturing, polymer processing, semiconductor processing, and more.

  • Compliance and Safety: Meets CDRH, ROHS, and CE standards.

Applications


  • Injector Drilling

  • Medical Device Manufacturing

  • Polymer Processing/Machining

  • Semiconductor/PV Processing/Wafer Scribing

  • High-Precision, High-Speed Micro-machining

  • Brittle Material Cutting, Drilling, Dicing & Sub-Surface Marking