AOFemto 1030nm 10W DPSS Laser

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Specifications

Avg. Power: 10 W
Wavelength: 1030 nm
Repetition Rate: 1 – 100 kHz
Spatial Mode (M^2): 1.3
Pulse Duration: 0.0008 ns
Pulse-to-Pulse Stability (RMS): 2 %
Cooling: Water-to-Water
Energy (µJ): 20
Repetition Rate (kHz): Single Shot to 1000
Beam Roundness (%): >85
Beam Diameter (mm): 2.0
Beam Divergence (mRad): <1.3
Point Stability (µrad/ºC): <20
Polarization Ratio: 100:1 Linear, Vertical
Pulse-to-Pulse Stability (% RMS): <2
Operational Temperature Range (ºC): 15 to 30
Storage Temperature Range (ºC): -20 to 50
Input Voltage (VAC): 90 to 260
Line Frequency (Hz): 50 or 60
Laser Head Dimensions: 27 x 15 x 7 in (686 x 381 x 179 mm)
Laser Head Weight: 70 lbs (32 kg)
Laser Controller Dimensions: 19 x 17 x 7 in (482 x 432 x 178 mm)
Laser Controller Weight: 30 lbs (13.6 kg)
Umbilical Length: 100 in (2.5 m)
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Features


  • Industry-Leading Cost Efficiency: The AOFemto™ Series offers the lowest cost of ownership in the industry, making it a cost-effective solution for various industrial applications.

  • Superior Beam Quality: Achieve excellent beam quality with an M2 value of less than 1.3, ensuring precision and accuracy in micro-machining tasks.

  • Versatile Wavelength Options: Available in IR, Green, and UV wavelengths to suit diverse application needs, including semiconductor processing and medical device manufacturing.

  • High Power Output: Delivers up to 15W average power, enabling high-speed and high-precision operations.

  • Ultra-Short Pulse Durations: Features pulse durations of less than 800 femtoseconds, ideal for intricate and detailed machining processes.

  • Robust and Reliable Design: Built with a highly reliable design to withstand demanding industrial environments.

  • Burst Mode Capability: Includes a burst mode option for enhanced performance in specific applications.

  • Wide Range of Applications: Suitable for injector drilling, polymer processing, wafer scribing, brittle material cutting, drilling, dicing, and sub-surface marking.

  • Compliance and Safety Standards: Meets CDRH, ROHS, and CE compliance standards, ensuring safe and reliable operation.

Applications


  • Injector Drilling

  • Medical Device Manufacturing

  • Polymer Processing/Machining

  • Semiconductor/PV Processing/Wafer Scribing

  • High-Precision, High-Speed Micro-machining

  • Brittle Material Cutting, Drilling, Dicing & Sub-Surface Marking