2W Picosecond DPSS Laser Source

Specifications

Avg. Power: 2 W
Wavelength: 1064 nm
Repetition Rate: 50 – 1000 kHz
Spatial Mode (M^2): 1.3
Pulse Duration: 0.015 ns
Pulse-to-Pulse Stability (RMS): 3 %
Cooling: Water-to-Water
Model Number: PS100-G
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Features


  • High Repetition Rate: The PS100-G operates at a pulse repetition rate of 50 – 1000kHz, allowing for high-speed processing.

  • Exceptional Beam Quality: Features a TEM00 spatial mode with M2 < 1.3, ensuring excellent beam quality for precision applications.

  • Ultra-Short Pulse Width: Delivers pulse widths of less than 15 picoseconds, ideal for delicate and precise material processing.

  • Burst Mode Capability: Offers burst mode for enhanced flexibility in various applications.

  • Robust Control Options: Equipped with RS232 and external GATE control for seamless integration and operation.

  • Cleanroom Assembled: Assembled in a 1000 class cleanroom to ensure high-quality standards and reliability.

  • Compact and Stable Design: The small size and compact design provide operational stability and ease of integration.

  • Easy Maintenance: Quick and easy replacement of the laser diode module minimizes downtime and maintenance efforts.

Applications


  • Material Micromachining: Enables precision structuring of metals, ceramics, and polymers with minimal heat-affected zones.

  • Glass Cutting and Drilling: Provides clean, micro-precision cuts and holes in glass substrates.

  • Wafer Dicing: Supports high-quality semiconductor wafer separation with reduced edge damage.

  • Sapphire Cutting and Drilling: Facilitates efficient processing of hard crystalline materials.

  • Film Etching: Allows fine patterning and structuring of thin films for electronic and optical applications.

  • Scientific Research: Ideal for advanced experiments requiring stable, ultra-short pulse picosecond lasers.