Specifications

Avg. Power: 10 W
Wavelength: 355 nm
Repetition Rate: 40 – 100 kHz
Spatial Mode (M^2): 1.3
Pulse Duration: 20 ns
Pulse-to-Pulse Stability (RMS): 2 %
Cooling: Water-to-Water
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Features


  • High UV Output Power: Provides 10W average power at 40kHz for demanding applications.

  • Ultra-Short Pulse Width: Delivers <20ns pulses for high-precision micromachining.

  • Adjustable Repetition Rate: Operates from 40 to 100kHz (up to 150kHz burst mode) for process flexibility.

  • Excellent Beam Quality: Maintains TEM00 spatial mode with M² <1.3 for clean processing.

  • Thermal Compensation Technology: Ensures efficient and stable harmonic conversion.

  • Comprehensive Control Options: RS232, GATE, TRIGGER, and PWM signals enable precise integration.

  • Compact and Robust Design: Facilitates easy system integration and installation.

  • High Long-Term Stability: Provides <±3% power stability over 8 hours for reliable operation.

Applications


  • Glass Cutting: Enables precise, high-speed UV cutting of glass substrates.

  • Laser Marking: Produces fine, durable markings on metals, plastics, and ceramics.

  • Material Micromachining: Supports intricate structuring of diverse materials with minimal heat effects.

  • Wafer Cutting: Ideal for dicing and scribing semiconductor wafers with high edge quality.

  • Micro-Drilling: Achieves micro-hole drilling in polymers, ceramics, and thin metals.

  • Laser Rapid Prototyping: Enhances additive manufacturing with UV-based fine detailing.

  • Scientific Research: Suitable for photonics experiments and material analysis requiring UV lasers.