PCBA Strain Measurement Solution for Stress Testing Instruments TSK-64-48C-12

Name: PCBA Strain Measurement Solution for Stress Testing Instruments TSK-64-48C-12
Brand: Dongguan Veshay Laser Technology Co., Ltd
Availability: InStock

Description

Supplier of Stress Testing Instruments

In the intricate world of electronics manufacturing, ensuring the reliability and durability of Printed Circuit Board Assemblies (PCBAs) is paramount. As a leading supplier of stress testing instruments, we specialize in providing comprehensive PCBA strain measurement solutions. Our expertise in this field is built on a foundation of understanding the critical role that mechanical stress plays in the lifecycle of PCBAs. Excessive mechanical stress during various stages such as Surface Mount Technology (SMT) assembly, panel cutting, and manual operations can lead to significant failures. These failures include cracked solder balls, circuit damage, and warped pads, which not only result in material losses but also impact investments in research and development, production, and quality assurance.

PCBA Strain Measurement Background

The necessity for precise strain measurement in PCBAs has been recognized and promoted by global industry leaders like Intel, IBM, HP, and Apple. This recognition has led to the establishment of standardized guidelines such as the IPC/JEDEC-9704A, which outlines the Printed Circuit Assembly Strain Gage Test. These standards have become benchmarks in the industry, providing systematic steps to identify defective assembly processes and perform effective strain testing. The guidelines emphasize the importance of early detection and correction of potential issues, as addressing problems during the design phase is significantly more cost-effective than during manufacturing or production.

PCBA Strain Measurement Purpose

The primary purpose of strain gage testing is to monitor and control mechanical stresses that can lead to PCBA failures. Solder joints, being particularly sensitive to strain, are prone to fracture mechanisms when subjected to stress-induced warpage. With the increasing application of lead-free PCB laminate materials and higher interconnect densities, the risk of damage due to warpage has risen. Incomplete cracking may not cause immediate failure, making it challenging to detect through functional tests alone. By implementing strain measurement, manufacturers can effectively reduce defective products, ensuring higher quality and reliability for end customers.

Specifications

Measurement Range:	-55500 – 55500 uE
Accuracy:	-0.3 – 0.3 %
Stability:	6 ppm/degC
Sampling Frequency:	10 KHz (per channel)
Operational Temperature Range:	-40 – 70 degC
Max Channel:	64
Current Channel:	48
Impedance:	120 Ohm

Download Data Sheet

Features

Comprehensive PCBA Strain Measurement Solution: Our instruments provide a complete solution for measuring strain on printed circuit board assemblies (PCBA), ensuring reliability and performance.
Industry-Standard Compliance: Adheres to IPC/JEDEC-9704A guidelines, the benchmark for PCBA strain gage testing, ensuring your processes meet global standards.
Wide Application Range: Suitable for various stages of PCBA processing including SMT assembly, panel cutting, manual operations, rework, repair, connector installation, and testing (ICT, FCT, etc.).
Prevention of Common Failures: Identifies and helps prevent common mechanical stress-induced failures such as cracked solder balls, circuit damage, and substrate cracks.
Cost-Effective Problem Solving: Early detection of strain issues can save significant costs, following the 1-10-100 rule: $1 during design, $10 during manufacturing, and $100 during production.
Enhanced Product Reliability: By monitoring and controlling mechanical stresses, manufacturers can reduce defective products and improve the reliability of their products for end customers.
Adaptation to Modern Materials: Effectively manages strain in lead-free PCB laminate materials and high interconnect density designs, where warpage-induced damage is more prevalent.
Proven Track Record: Supported by major global manufacturers like Intel, IBM, HP, and Apple, ensuring trust and reliability in our measurement solutions.

Applications

Typical Processing Needs Strain Measurement:
- SMT Assembly
- Panel Cutting
- Manual Operation
- All Rework and Repair Process
- Connector Installation
- PCB Testing
- ICT, FCT, or Equivalent Functional Test
- Mechanical Assembly:
  - Heat Sink Assembly
  - PCI or Daughterboard Installation
  - DIMM (Dual In-line Memory Module) Installation
Common Modes of Failure Due to Mechanical Stress:
- Cracked Solder Balls
- Circuit Damage
- Warped Pads
- Cracked Substrates
- Capacitor Y-cracks and 45° Cracks
PCBA Strain Gage Test Guidelines:
- Issued by IPC and JEDEC in 2005
- Revised Version A in 2012
- Identify Defective Assembly and Test Processing
- Provide Systematic Steps to Perform PCBA Strain Testing
Measurement Standards:
- INTEL for Strain
Cost Implications:
- A problem can be solved with 1 dollar during the design phase of PCBA, while it costs 10 dollars at least during manufacturing and 100 dollars more during production.
- The later a problem is discovered, the more cost doubles increased. Rules that should be known: 1-10-100
Measurement Purpose:
- Solder joints are sensitive to strain, under which PCB stress warpage deformation leads to fracture mechanism.
- As lead-free new PCB laminate materials are widely applied and interconnect density rises, damage caused by warpage increased.
- Incomplete cracking probably causes no instant PCBA failure, which cannot always be detected by functional tests.
- Clients can reduce defective products for end customers by monitoring and controlling the mechanical stresses effectively during manufacturer's testing and assembly.

Name

Work Email

Organization (recommended)

Your message to supplier

Add to Watchlist (My Watchlist)

Ships from:

China

Sold by:

Dongguan Veshay Laser Technology Co., Ltd

On FindLight:

since 2024

Got Questions? Ask Above ▲

Message the supplier directly
No signup or account needed
No FindLight fees or markups
Expect a fast reply

Frequently Asked Questions

What is the purpose of PCBA strain measurement?

The purpose of PCBA strain measurement is to monitor and control mechanical stresses during testing and assembly to reduce defective products and prevent failures such as cracked solder balls and circuit damage.

What are some common modes of failure due to mechanical stress in PCBAs?

Common modes of failure include cracked solder balls, circuit damage, warped pads, cracked substrates, and capacitor Y-cracks and 45° cracks.

Why is strain gage testing important in the design and manufacturing of PCBAs?

Strain gage testing is important because it helps identify and mitigate mechanical stress issues early in the design phase, which is cost-effective compared to addressing them during manufacturing or production.

What is the IPC/JEDEC-9704A guideline?

The IPC/JEDEC-9704A is a guideline for printed circuit assembly strain gage testing, providing systematic steps to identify defective assembly and test processing.

How does mechanical stress affect solder joints in PCBAs?

Solder joints are sensitive to strain, and mechanical stress can cause PCB stress warpage deformation, leading to fracture mechanisms and potential failures.

What is the '1-10-100' rule mentioned in the datasheet?

The '1-10-100' rule states that a problem solved during the design phase costs 1 dollar, during manufacturing costs 10 dollars, and during production costs 100 dollars, emphasizing the importance of early problem detection.

Which global manufacturers promote the standards of IPC and JEDEC for strain measurement?

Global manufacturers such as Intel, IBM, HP, and Apple actively promote the standards of IPC and JEDEC for strain measurement.