Triaxial Strain Gauge TSK-1A-120-3A-11L30W07MS

Name: Triaxial Strain Gauge TSK-1A-120-3A-11L30W07MS
Brand: Dongguan Veshay Laser Technology Co., Ltd
Availability: InStock

Description

Supplier of Stress Testing Instruments

In the intricate world of electronics manufacturing, ensuring the reliability and durability of Printed Circuit Board Assemblies (PCBA) is paramount. As a leading supplier of stress testing instruments, we provide comprehensive solutions for PCBA strain measurement. Our offerings are designed to meet the rigorous demands of modern electronics production, where precision and accuracy are crucial.

PCBA Strain Measurement: An Essential Insight

PCBA strain measurement is a critical process that helps manufacturers identify potential failure points in circuit assemblies. During various stages such as Surface Mount Technology (SMT) assembly, panel cutting, and manual operations, PCBAs are subjected to mechanical stresses that can lead to defects. These defects, including cracked solder balls and circuit damage, can compromise the integrity of the assembly. By implementing strain measurement, manufacturers can detect these issues early, reducing material costs and safeguarding investments in research and development.

Industry Standards and Guidelines

The importance of PCBA strain measurement has been recognized globally, with standards established by leading organizations such as IPC and JEDEC. The IPC/JEDEC-9704A guideline serves as an industry benchmark, providing systematic steps for conducting PCBA strain tests. This guideline, supported by major manufacturers like Intel and Apple, underscores the necessity of strain measurement in maintaining high-quality production standards.

The Cost-Effectiveness of Early Detection

Addressing potential strain issues during the design phase of PCBA can be remarkably cost-effective. The principle of "1-10-100" highlights that resolving a problem early can cost as little as one dollar, whereas the same issue can escalate to ten dollars during manufacturing and a hundred dollars during production. This exponential increase in cost emphasizes the value of early detection and intervention, making PCBA strain measurement an indispensable tool in the electronics manufacturing process.

Purpose of Strain Gage Testing

Strain gage testing is vital for identifying stress-induced deformations that can lead to fractures in solder joints. As the industry shifts towards lead-free materials and higher interconnect densities, the risk of damage from warpage increases. Strain gage testing helps manufacturers monitor and control these mechanical stresses, ensuring that incomplete cracking does not go undetected. By effectively managing these stresses, manufacturers can significantly reduce the incidence of defective products reaching end customers, thereby enhancing product reliability and customer satisfaction.

Specifications

Device Funtion:	Strain Gauge
Measurement Range:	-55500 – 55500 uE
Accuracy:	-0.3 – 0.3 %
Stability:	6 ppm/degC
Sampling Frequency:	10 KHz (per channel)
Operational Temperature Range:	-40 – 70 degC
Gauge Type:	Triaxial
Impedance:	120 Ohm
Grid Legth:	1.1 x 1.0 mm
Base Size:	5 mm
Insulated Wire:	30 cm
Extension Wire:	70 cm

Download Data Sheet

Features

Comprehensive PCBA Strain Measurement Solution: Our product offers a complete solution for measuring strain on printed circuit board assemblies (PCBA), ensuring reliability and performance.
Industry Standard Compliance: Adheres to IPC/JEDEC-9704A guidelines, recognized globally by leading manufacturers like Intel, IBM, HP, and Apple.
Wide Application Range: Suitable for various stages of PCBA processing, including SMT assembly, panel cutting, manual operations, rework, repair processes, connector installation, and PCB testing.
Prevention of Common Failures: Helps identify and prevent common mechanical stress-related failures such as cracked solder balls, circuit damage, warped pads, and substrate cracks.
Cost-Effective Testing: Early detection of strain issues can save significant costs, following the 1-10-100 rule, where early design phase solutions are far more economical than later-stage fixes.
Enhanced Product Reliability: By monitoring and controlling mechanical stresses, manufacturers can reduce defective products and improve end-customer satisfaction.
Advanced Testing Methodology: Provides systematic steps for performing PCBA strain testing, ensuring thorough and accurate results.
Adaptability to New Materials: Effective for lead-free PCB laminate materials and high interconnect density applications, addressing modern manufacturing challenges.

Applications

Typical Processing Needs Strain Measurement:
- SMT Assembly
- Panel Cutting
- Manual Operation
- All Rework and Repair Process
- Connector Installation
- PCB Testing
- ICT, FCT, or Equivalent Functional Test
- Mechanical Assembly:
  - Heat Sink Assembly
  - PCI or Daughterboard Installation
  - DIMM (Dual In-line Memory Module) Installation
Printed Circuit Assembly Strain Gage Test Guideline:
- IPC/JEDEC-9704A
Common Modes of Failure Due to Mechanical Stress:
- Cracked Solder Balls
- Circuit Damage
- Warped Pads
- Cracked Substrates
- Capacitor Y-Cracks and 45° Cracks
PCBA Strain Gage Test as an Industry Benchmark:
- Issued by IPC and JEDEC in 2005
- Revised Version A in 2012
- Identify Defective Assembly and Test Processing
- Provide Systematic Steps to Perform PCBA Strain Testing
Measurement Purpose:
- Solder Joints are Sensitive to Strain
- Lead-Free PCB Laminate Materials Increase Warpage Damage
- Incomplete Cracking May Not Cause Instant PCBA Failure
- Monitoring and Controlling Mechanical Stresses Reduces Defective Products

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Frequently Asked Questions

What is the purpose of PCBA strain measurement?

The purpose of PCBA strain measurement is to monitor and control mechanical stresses during manufacturing and assembly to prevent failures such as cracked solder balls, circuit damage, and warped pads.

What are some common modes of failure due to mechanical stress in PCBAs?

Common modes of failure include cracked solder balls, circuit damage, warped pads, cracked substrates, and capacitor Y-cracks and 45° cracks.

What is the IPC/JEDEC-9704A guideline?

The IPC/JEDEC-9704A is a guideline for Printed Circuit Assembly Strain Gage Testing, issued by IPC and JEDEC, to identify defective assembly and test processing and provide systematic steps for PCBA strain testing.

Why is strain gage testing important for solder joints?

Solder joints are sensitive to strain, and stress-induced warpage can lead to fracture mechanisms. Strain gage testing helps detect and prevent these issues.

How does the cost of addressing PCBA issues change over time?

Addressing a problem during the design phase costs 1 dollar, during manufacturing it costs at least 10 dollars, and during production, it can cost 100 dollars or more. The later a problem is discovered, the more the cost increases.

What are some applications where PCBA strain measurement is crucial?

PCBA strain measurement is crucial in SMT assembly, panel cutting, manual operations, rework and repair processes, connector installation, PCB testing, and mechanical assembly such as heat sink assembly and DIMM installation.

How has the industry adopted PCBA strain gage testing?

Global manufacturers like Intel, IBM, HP, and Apple have promoted PCBA strain gage testing, and it has become a standard in the industry as per IPC and JEDEC guidelines.