Uniaxial Strain Gauge TSK-1B-120-1A-11L1M2S

Name: Uniaxial Strain Gauge TSK-1B-120-1A-11L1M2S
Brand: Dongguan Veshay Laser Technology Co., Ltd
Availability: InStock

Description

Supplier of Stress Testing Instruments

In the ever-evolving landscape of electronics manufacturing, ensuring the reliability and durability of printed circuit board assemblies (PCBAs) is paramount. As a leading supplier of stress testing instruments, we provide comprehensive solutions for PCBA strain measurement, a critical aspect of maintaining the integrity of electronic components. Our advanced tools are designed to help manufacturers identify and mitigate mechanical stress, which can lead to various failure modes in PCBAs.

PCBA Strain Measurement Background

During the stages of Surface Mount Technology (SMT), Dual In-line Package (DIP) assembly, and reliability testing, PCBAs are subjected to mechanical stress that can result in failures such as cracked solder balls, circuit damage, and warped pads. These issues not only incur material costs but also impact investments in research and development, production, and joint investigations. Our strain measurement solutions are essential in detecting and addressing these potential failures early in the process.

Industry Standards and Guidelines

Our PCBA strain measurement solutions align with industry standards set by global leaders such as Intel, IBM, HP, and Apple. The IPC/JEDEC-9704A guideline for Printed Circuit Assembly Strain Gage Testing, first issued in 2005 and revised in 2012, serves as a benchmark for identifying defective assembly and test processes. By adhering to these standards, manufacturers can systematically perform PCBA strain testing, ensuring the highest quality and reliability of their products.

The Importance of Early Detection

Addressing strain-related issues early in the design phase can significantly reduce costs. The well-known 1-10-100 rule highlights that a problem solved during the design phase costs only a fraction compared to addressing it during manufacturing or production. Our strain measurement solutions empower clients to monitor and control mechanical stresses effectively, reducing the likelihood of defective products reaching end customers and enhancing overall product quality.

Measurement Purpose

Strain gage testing is crucial because solder joints are particularly sensitive to strain, which can lead to warpage and fracture. As the use of lead-free PCB laminate materials and interconnect density increases, the risk of damage from warpage also rises. Incomplete cracking may not cause immediate PCBA failure and might not be detected by functional tests. By implementing our strain measurement solutions, clients can proactively manage mechanical stresses during testing and assembly, ensuring the longevity and reliability of their electronic products.

Specifications

Device Funtion:	Strain Gauge
Measurement Range:	-55500 – 55500 uE
Accuracy:	-0.3 – 0.3 %
Stability:	6 ppm/degC
Sampling Frequency:	10 KHz (per channel)
Operational Temperature Range:	-40 – 70 degC
Gauge Type:	Uniaxial
Impedance:	120 Ohm
Grid Length:	1.1*1.0mm
Base Size:	3.9 x 1.7 mm
Insulated Wire:	2 cm
Extension Wire:	100 cm

Download Data Sheet

Features

Comprehensive Stress Testing Instruments: Our product is a leading solution provider for PCBA strain measurement, ensuring precise and reliable results.
Industry-Standard Compliance: Adheres to IPC/JEDEC-9704A guidelines, recognized globally by top manufacturers like Intel, IBM, HP, and Apple.
Versatile Application: Suitable for various stages including SMT assembly, panel cutting, manual operations, rework and repair processes, connector installation, and PCB testing.
Cost-Effective Solution: Address potential issues early in the design phase to save costs significantly, following the 1-10-100 rule.
Enhanced Reliability: Identifies defective assembly and test processes, providing systematic steps for effective PCBA strain testing.
Prevention of Common Failures: Helps prevent cracked solder balls, circuit damage, warped pads, and other mechanical stress-related failures.
Advanced Measurement Purpose: Monitors and controls mechanical stresses to reduce defective products, ensuring high-quality outcomes for end customers.
Proactive Problem Solving: Detects issues that might not be immediately apparent through functional tests, preventing long-term damage.

Applications

Typical Processing Needs Strain Measurement
- SMT Assembly
- Panel Cutting
- Manual Operation
- All Rework and Repair Process
- Connector Installation
- PCB Testing
- ICT, FCT, or Equivalent Functional Test
- Mechanical Assembly:
  - Heat Sink Assembly
  - PCI or Daughterboard Installation
  - DIMM (Dual In-line Memory Module) Installation
Printed Circuit Assembly Strain Gage Test Guideline
- IPC/JEDEC-9704A
Common Modes of Failure Due to Mechanical Stress
- Cracked Solder Balls
- Circuit Damage
- Warped Pads
- Cracked Substrates
- Capacitor Y-Cracks and 45° Cracks
PCBA Strain Gage Test as an Industry Benchmark
- Issued by IPC and JEDEC in 2005
- Revised Version A in 2012
- Identify Defective Assembly and Test Processing
- Provide Systematic Steps to Perform PCBA Strain Testing
Measurement Standards
- Intel for Strain
Cost Implications of Strain Measurement
- A problem solved with $1 during design phase costs $10 during manufacturing and $100 during production.
- The later a problem is discovered, the more costs double.
Measurement Purpose
- Solder joints are sensitive to strain, leading to fracture mechanisms.
- Lead-free PCB laminate materials and increased interconnect density increase damage from warpage.
- Incomplete cracking may not cause instant PCBA failure, undetectable by functional tests.
- Clients can reduce defective products by monitoring and controlling mechanical stresses during testing and assembly.

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Frequently Asked Questions

What is the purpose of PCBA strain measurement?

The purpose of PCBA strain measurement is to monitor and control mechanical stresses during manufacturing and assembly to prevent failures such as cracked solder balls, circuit damage, and warped pads.

What are some common modes of failure due to mechanical stress in PCBAs?

Common modes of failure include cracked solder balls, circuit damage, warped pads, cracked substrates, capacitor Y-cracks, and 45° cracks.

Why is strain gage testing important for PCBAs?

Strain gage testing is important because it helps identify defective assembly and test processes, and it provides systematic steps to perform PCBA strain testing, reducing the risk of failures and associated costs.

What is the IPC/JEDEC-9704A guideline?

The IPC/JEDEC-9704A is a guideline for Printed Circuit Assembly Strain Gage Testing, issued by IPC and JEDEC, which provides standards for identifying defective assembly and test processing.

How does the cost of addressing PCBA issues change over time?

Addressing PCBA issues costs $1 during the design phase, $10 during manufacturing, and $100 during production. The later a problem is discovered, the more the cost increases.

What industries or companies promote PCBA strain measurement standards?

Global manufacturers such as Intel, IBM, HP, and Apple actively promote PCBA strain measurement standards, which have become official standards of IPC and JEDEC.

What is the significance of the 1-10-100 rule in PCBA measurement?

The 1-10-100 rule highlights that the cost of solving a problem increases significantly the later it is discovered, emphasizing the importance of early detection and measurement in the design phase.