Biaxial Strain Gauge TSK-1A-120-2A-11L30W07MS

Name: Biaxial Strain Gauge TSK-1A-120-2A-11L30W07MS
Brand: Dongguan Veshay Laser Technology Co., Ltd
Availability: InStock

Description

Supplier of Stress Testing Instruments

In the intricate world of electronics manufacturing, ensuring the reliability and durability of Printed Circuit Board Assemblies (PCBA) is paramount. As a leading supplier of stress testing instruments, we provide comprehensive solutions for PCBA strain measurement, a critical aspect in the production and testing phases of electronic components. Our expertise in this field helps manufacturers identify and mitigate potential issues that could lead to costly failures.

PCBA Strain Measurement Background

During the various stages of Surface Mount Technology (SMT), Dual In-line Package (DIP) assembly, and reliability testing, PCBAs are subjected to mechanical stresses that can lead to failure. Common failure modes include cracked solder balls, circuit damage, warped pads, and substrate cracks. These failures not only result in material losses but also impact investments in research and development, production, and quality assurance processes. Our strain measurement solutions are designed to address these challenges effectively.

Industry Standards and Guidelines

Under the guidance of global industry leaders such as Intel, IBM, HP, and Apple, strain measurement has become a standardized practice, as outlined in the IPC/JEDEC-9704A guidelines. These standards provide a systematic approach to identifying defective assembly and testing processes, ensuring that manufacturers can maintain high-quality standards and reduce the risk of product failures.

The Importance of Early Detection

Addressing potential strain-related issues during the design phase of PCBA can be remarkably cost-effective. A problem that costs a mere dollar to fix during design could escalate to ten dollars during manufacturing and a hundred dollars during production. This 1-10-100 rule underscores the importance of early detection and intervention, making PCBA strain measurement an essential component of the manufacturing process.

Purpose of Strain Gage Testing

Strain gage testing is crucial for several reasons. Solder joints are particularly sensitive to strain, and any stress-induced warpage can lead to fractures. With the increasing use of lead-free PCB laminate materials and higher interconnect densities, the risk of damage due to warpage has risen. Moreover, incomplete cracking may not cause immediate failure, making it difficult to detect through functional tests alone. By effectively monitoring and controlling mechanical stresses, manufacturers can significantly reduce the incidence of defective products reaching end customers.

Specifications

Device Funtion:	Strain Gauge
Measurement Range:	-55500 – 55500 uE
Accuracy:	-0.3 – 0.3 %
Stability:	6 ppm/degC
Sampling Frequency:	10 KHz (per channel)
Operational Temperature Range:	-40 – 70 degC
Gauge Type:	Biaxial
Impedance:	120 Ohm
Grid Length:	1.1 X 1.0 mm
Base Size:	5mm
Insulated Wire:	30 cm
Extension Wire:	100 cm

Download Data Sheet

Features

Comprehensive Stress Testing Instruments: Our product is a leading solution for measuring strain in printed circuit board assemblies (PCBA), ensuring reliability and performance.
PCBA Strain Measurement Expertise: We provide a complete solution for measuring strain in PCBAs, crucial for maintaining the integrity of electronic components.
Industry Standards Compliance: Our testing methods adhere to the IPC/JEDEC-9704A guidelines, recognized globally by major manufacturers like Intel, IBM, HP, and Apple.
Application Versatility: Suitable for various processes including SMT assembly, panel cutting, manual operations, rework and repair, connector installation, and mechanical assembly.
Preventive Cost Efficiency: Addressing strain issues early in the design phase can save significant costs, following the 1-10-100 rule: $1 during design, $10 during manufacturing, and $100 during production.
Critical Failure Prevention: Identifies potential failure modes such as cracked solder balls, circuit damage, and substrate cracks, preventing costly defects and ensuring product longevity.
Advanced Measurement Purpose: Our strain gage tests are crucial for detecting warpage and deformation in PCBs, especially with the rise of lead-free materials and higher interconnect densities.
Enhanced Product Quality: By monitoring and controlling mechanical stresses, manufacturers can significantly reduce defective products, ensuring high-quality outcomes for end customers.

Applications

Typical Processing Needs Strain Measurement:
- SMT Assembly
- Panel Cutting
- Manual Operation
- All Rework and Repair Process
- Connector Installation
- PCB Testing
- ICT, FCT, or Equivalent Functional Test
- Mechanical Assembly:
  - Heat Sink Assembly
  - PCI or Daughterboard Installation
  - DIMM (Dual In-line Memory Module) Installation
Common Modes of Failure Due to Mechanical Stress:
- Cracked Solder Balls
- Circuit Damage
- Warped Pads
- Cracked Substrates
- Capacitor Y-Cracks and 45° Cracks
PCBA Strain Gage Test Guideline:
- Issued by IPC and JEDEC in 2005
- Revised Version A in 2012
- Identify Defective Assembly and Test Processing
- Provide Systematic Steps to Perform PCBA Strain Testing
Measurement Purpose:
- Solder Joints are Sensitive to Strain
- Lead-Free PCB Laminate Materials Increase Warpage Damage
- Incomplete Cracking May Not Cause Immediate Failure
- Monitoring and Controlling Mechanical Stresses Reduces Defective Products
Cost Implications:
- A Problem Solved in Design Phase Costs $1
- During Manufacturing, it Costs $10
- During Production, it Costs $100
- The Later a Problem is Discovered, the More Costs Increase

Name

Work Email

Organization (recommended)

Your message to supplier

Add to Watchlist (My Watchlist)

Ships from:

China

Sold by:

Dongguan Veshay Laser Technology Co., Ltd

On FindLight:

since 2024

Got Questions? Ask Above ▲

Message the supplier directly
No signup or account needed
No FindLight fees or markups
Expect a fast reply

Frequently Asked Questions

What is the purpose of PCBA strain measurement?

The purpose of PCBA strain measurement is to monitor and control mechanical stresses during testing and assembly to reduce defective products and prevent failures such as cracked solder balls and circuit damage.

What are some common modes of failure due to mechanical stress in PCBAs?

Common modes of failure due to mechanical stress in PCBAs include cracked solder balls, circuit damage, warped pads, cracked substrates, and capacitor Y-cracks and 45° cracks.

What is the IPC/JEDEC-9704A guideline?

The IPC/JEDEC-9704A is a guideline for Printed Circuit Assembly Strain Gage Testing, issued by IPC and JEDEC, which provides systematic steps to perform PCBA strain testing and identify defective assembly and test processing.

Why is strain gage testing important for solder joints?

Strain gage testing is important for solder joints because they are sensitive to strain, which can lead to warpage deformation and fracture mechanisms, especially with the use of lead-free PCB laminate materials and increased interconnect density.

What is the '1-10-100' rule mentioned in the datasheet?

The '1-10-100' rule indicates that a problem that can be solved for 1 dollar during the design phase of PCBA will cost 10 dollars during manufacturing and 100 dollars during production, highlighting the increasing cost of addressing issues later in the process.

Which global manufacturers promote the PCBA strain gage test standards?

Global manufacturers such as Intel, IBM, HP, and Apple actively promote the PCBA strain gage test standards, which have become official standards of IPC and JEDEC.

What are some applications where PCBA strain measurement is necessary?

PCBA strain measurement is necessary in applications such as SMT assembly, panel cutting, manual operations, rework and repair processes, connector installation, PCB testing, and mechanical assembly tasks like heat sink and DIMM installation.