AONano 527-12W-10K ND:YLF GR Laser

Specifications

Avg. Power: 12 W
Wavelength: 527 nm
Repetition Rate: 1 – 20 kHz
Spatial Mode (M^2): 1.2
Pulse Duration: 30 ns
Pulse-to-Pulse Stability (RMS): 2 %
Cooling: Water-to-Air
Average Power: 5W, 10W, 15W
Spatial Mode: TEM00
Beam Roundness: >90%
Pulse Width (ns): <10ns @20kHz, <30ns @100kHz, <10ns @20kHz, <40ns @100kHz, <10ns @20kHz, <40ns @100kHz
Pulse Energy (mJ @ 1kHz): >150uJ, >300uJ, >300uJ
Polarization Ratio: >100:1 LINEAR, VERTICAL
Communication Protocol: RS-232
Operating Voltage (VAC): 90-260
Line Frequency (Hz): 47-63
Operation Temperature: 15º - 30º C
Storage Temperature: -20º - 50º C
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Features

  • Innovative End-Pumping Technology: Enhances efficiency and performance for industrial applications.
  • Air-Cooling (Average Power Up to 10W): Efficient cooling system ensures optimal performance without the need for liquid cooling.
  • Excellent Beam Quality, Pulse Stability & Point Stability: Delivers precise and reliable results for demanding tasks.
  • Patent Pending Harmonic Conversion Technologies: Advanced technology for superior laser performance.
  • Ultra-Compact & Light-Weight: Easy to integrate and handle in various industrial environments.
  • Brand-New Focusing Optics: Provides improved focusing capabilities for enhanced precision.
  • Field-Replaceable Diode: Simplifies maintenance and reduces downtime.
  • 24/7 Proven Reliability: Engineered for continuous operation in production environments.
  • Low Operational Cost: Cost-effective solution due to efficient technology and design.
  • Pulse Frequencies Ranging from 1-300 kHz: Offers flexibility for various applications, with an optional range up to 1 MHz.
  • Average Power from 10mW to 30W: Suitable for a wide range of industrial applications, with higher power options available.
  • Pulse Energy in Excess of 10mJ: Powerful enough to handle demanding tasks.
  • Sealed Laser Head: Ensures long-term reliability by protecting the system from environmental factors.

Applications

  • Precision Micromachining: High beam quality and stability ideal for micro-drilling and cutting.
  • Semiconductor Processing: Accurate scribing, dicing, and marking of semiconductor wafers.
  • Electronics Manufacturing: PCB drilling, component marking, and fine-feature structuring.
  • Medical Device Fabrication: Laser cutting and marking of surgical instruments and implants.
  • Photovoltaic Industry: Efficient scribing and edge isolation for solar cell production.