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Frequently Asked Questions

The absolute maximum ratings of the TFMD5000 include a reverse voltage of 60V, power dissipation of 215mW, junction temperature of 100°C, storage temperature range of -55°C to +100°C, and soldering temperature of 260°C for up to 3 seconds.

The applications of the TFMD5000 include sensors, encoders, medical equipment, fiber optics, and automotive equipment.

The TFMD5000 comes in three different versions: standard clear encapsulation lens for responsivity from visible to 1000nm, a red encapsulant lens for applications that are required to filter out visible ambient light interference, and a black encapsulant lens for applications where higher responsivity in the infrared region is required.

The features of the TFMD5000 include a large radiant sensitive area (8.1mm2), wide angle of half sensitivity φ= ±65°, high photo sensitivity, fast response times, and small junction capacitance.

The TFMD5000R is a new device that is a super low profile and has an overall dimension of 5x4x1.1mm. It can accept a PIN photodiode chip with an active area up to 10mm square.

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