DMX Series High Power Nanosecond Lasers

Specifications

Avg. Power: 60 W
Wavelength: 532 nm
Repetition Rate: 1 – 50 kHz
Spatial Mode (M^2): 15
Pulse Duration: 120 ns
Pulse-to-Pulse Stability (RMS): 1 %
Cooling: Water-to-Water, Water-to-Air
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Features

  • High Power Output: Achieve up to 200W from a single head and up to 400W from a dual head at 532 nm, ideal for high repetition rate applications.
  • Compact and Efficient Design: Features a monolithic platform with integrated controls within the laser head for ease of use via GUI software.
  • Flexible Repetition Rates: Adjustable from 1 to 30 kHz for lower power models and 1 to 50 kHz for higher power models, catering to various application needs.
  • Proprietary Twin Pulse Option: Offers a unique twin pulse mode for enhanced performance, with user-programmable energy ratio and pulse separation.
  • Dual Head Configuration: Available for even higher output powers and sub-microsecond pulse separations, with GUI software adjustable turning mirrors.
  • Uniform Beam Profile: Ensures superior pulse-to-pulse stability and consistent performance across applications.
  • Robust Applications: Suitable for Particle Image Velocimetry (PIV), annealing, pumping Ti:Sa ultrafast amplifier systems, and high power drilling or cutting of hard materials.
  • Optimized Power Supply: Ideally sized for 19” rack-mount configurations, with an optional flange kit available.
  • Superior Stability: Offers pulse-to-pulse stability of < 1.0% rms and long-term stability of < 0.5% rms.
  • Advanced Beam Characteristics: Horizontal polarization with a 100:1 ratio, nominal beam diameters of 2.0 mm and 5.0 mm, and beam circularity > 85%.
  • Versatile Interface Options: Includes RS 232, external TTL triggering, and GUI software for seamless integration and control.

Applications

  • Particle Image Velocimetry (PIV): High-power pulsed illumination for fluid dynamics research.
  • Ti:Sapphire Amplifier Pumping: Reliable excitation for ultrafast laser systems.
  • Material Annealing / Bleaching: Modify material properties without ablation.
  • High-Energy Drilling & Cutting: Precision processing of hard and brittle materials.