AONano 355-8W-10K ND:YAG UV Laser

Specifications

Avg. Power: 8 W
Wavelength: 355 nm
Repetition Rate: 1 – 20 kHz
Spatial Mode (M^2): 1.2
Pulse Duration: 30 ns
Pulse-to-Pulse Stability (RMS): 2 %
Cooling: Water-to-Air
Spatial Mode: TEM00
Beam Roundness: >90%
Pulse Width (ns) At 1kHz: <40ns
Document icon Download Data Sheet Download icon

Features


  • Innovative End-Pumping Technology: Ensures efficient laser performance and longevity.

  • Air-Cooling (Average Power Up to 6W): Provides reliable cooling for high-power operations without the need for liquid cooling systems.

  • Excellent Beam Quality, Pulse Stability & Point Stability: Delivers precise and consistent laser output, ideal for demanding applications.

  • Patent Pending Harmonic Conversion Technologies: Enhances laser capabilities and performance.

  • Ultra-Compact & Light-Weight: Designed for space-saving installations and easy handling.

  • Brand-New Focusing Optics: Offers improved accuracy and focus for high-precision tasks.

  • Field-Replaceable Diode: Simplifies maintenance and reduces downtime with easy diode replacement.

  • 24/7 Proven Reliability: Engineered for continuous operation in industrial environments.

  • Low Operational Cost: Cost-effective operation with minimal maintenance requirements.

  • Wide Pulse Frequency Range: From 1-300 kHz, with options up to 500 kHz for versatile applications.

  • Flexible Laser Architectures: Designed to meet diverse and specific laser requirements.

  • Sealed Laser Head: Ensures long-term reliability by protecting components in a clean environment.

Applications


  • Microelectronics Manufacturing: Ideal for precision tasks such as wafer dicing, circuit trimming, and micro-drilling.

  • Semiconductor Processing: Utilized in processes like photolithography and silicon wafer processing.

  • Medical Device Manufacturing: Used for precise cutting and shaping of medical components.

  • Solar Cell Production: Essential for scribing and structuring photovoltaic cells.

  • Display Manufacturing: Applied in the production of LCD and OLED displays for cutting and patterning.

  • Glass and Ceramics Processing: Effective for cutting, marking, and engraving on glass and ceramic materials.

  • Plastics and Polymers Processing: Suitable for marking, engraving, and cutting of various plastic materials.

  • R&D and Prototyping: Valuable in research settings for developing and testing new materials and processes.

  • Textile Industry: Used for precision cutting and engraving on fabrics and textiles.

  • Automotive Industry: Applied in the manufacturing of automotive components and micro-machining tasks.