Specifications

Avg. Power: 7 W
Wavelength: 355 nm
Repetition Rate: 20 – 100 kHz
Spatial Mode (M^2): 1.3
Pulse Duration: 25 ns
Pulse-to-Pulse Stability (RMS): 3 %
Cooling: Water-to-Water
Model Number: MP101
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Features


  • High Power Output: The MP101 UV Nanosecond Laser features a dual laser diode pumped crystal architecture, delivering high power output at a 355 nm wavelength.

  • Advanced Beam Quality: Designed with advanced resonant cavity and laser control technology, ensuring excellent beam quality and narrow pulse widths during high power operation.

  • Stable Frequency Conversion: Special thermal compensation and harmonic generation technologies provide stable and efficient frequency conversion.

  • Versatile Pulse Repetition Rate: Offers a pulse repetition rate of 20 – 100 kHz, adjustable up to 150 kHz for various applications.

  • Precision and Stability: Achieves a spatial mode of TEM00 with M2 < 1.3, ensuring high long-term stability and precision.

  • Compact Design: Features a small size and compact structure, making it suitable for various installation environments.

  • Easy Integration: Equipped with RS232, external GATE, and PWM control for seamless integration into existing systems.

  • Field-Replaceable Components: The laser diode module is field-replaceable, ensuring easy maintenance and reduced downtime.

  • Cleanroom Assembled: Assembled in a class 1000 cleanroom to maintain high quality and reliability.

  • Wide Range of Applications: Ideal for film etching, laser marking, material micromachining, wafer cutting, micro-drilling, laser rapid prototyping, and scientific research.

  • Efficient Cooling: Utilizes water-cooling to maintain optimal operating temperature.

  • Wide Operating Conditions: Operates efficiently within an ambient temperature range of 15 – 30℃ and relative humidity of 10%-80% (non-condensing).

  • Quick Start-Up: Warm-up time of less than 10 minutes for rapid deployment.

  • Flexible Power Requirements: Operates on a wide voltage range of 90 – 260 V, accommodating various power supply conditions.

Applications


  • Film Etching: Enables precise patterning of thin film materials.

  • Laser Marking: Provides high-contrast, durable markings on various substrates.

  • Material Micromachining: Supports fine microfabrication with minimal thermal damage.

  • Wafer Cutting: Ideal for semiconductor wafer dicing and scribing.

  • Micro-Drilling: Performs high-precision drilling of micro-holes in diverse materials.

  • Laser Rapid Prototyping: Enhances additive manufacturing processes with UV precision.

  • Scientific Research: Suitable for advanced photonics and materials research.