10W Picosecond DPSS Laser Source

Specifications

Avg. Power: 10 W
Wavelength: 1064 nm
Repetition Rate: 50 – 500 kHz
Spatial Mode (M^2): 1.3
Pulse Duration: 0.015 ns
Pulse-to-Pulse Stability (RMS): 3 %
Cooling: Water-to-Water
Model Number: P302
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Features


  • Advanced Laser Technology: The P302 Picosecond Laser combines an advanced free-space solid state amplifier with fiber laser technology for superior performance.

  • High Power Output: Achieves average power of over 10W at 500kHz, suitable for demanding applications.

  • Adjustable Pulse Repetition Rate: Offers flexibility with a pulse repetition rate adjustable from 50 to 500 kHz.

  • Excellent Beam Quality: Features a TEM00 spatial mode with M2 <1.3, ensuring high-quality beam output.

  • Ultra-Short Pulse Width: Delivers pulse widths of less than 15 picoseconds for precise processing with minimal heat-affected zones.

  • Burst Mode: Includes a burst mode for enhanced operational capabilities.

  • Compact and Stable Design: Compact design with high long-term stability, making it suitable for various industrial environments.

  • Control Options: Equipped with RS232 and external GATE control for easy integration into existing systems.

  • Field-Replaceable Laser Diode Module: Simplifies maintenance and reduces downtime.

  • Wide Range of Applications: Ideal for material micromachining, glass cutting and drilling, wafer dicing, sapphire cutting and drilling, thin film cutting, and scientific research.

  • Precision and Stability: Features <3% rms pulse-to-pulse instability and <3% rms average power stability over 8 hours.

  • Efficient Cooling: Water-cooling system ensures optimal performance and longevity.

  • Environmental Adaptability: Operates in ambient temperatures of 15 – 30℃ and can be stored between -10 – 50℃.

  • Quick Start-Up: Warm-up time is less than 10 minutes, allowing for rapid deployment.

  • Versatile Voltage Range: Operates on a wide voltage range of 90 – 260V, accommodating various power supplies.

Applications


  • Material Micromachining: Enables precise microfabrication with minimal thermal damage.

  • Glass Cutting and Drilling: Ideal for processing brittle and transparent materials with high accuracy.

  • Wafer Dicing: Provides clean and precise dicing of semiconductor wafers.

  • Sapphire Cutting and Drilling: Supports advanced processing of hard crystalline materials.

  • Thin Film Cutting: Ensures precise separation of delicate thin film layers.

  • Scientific Research: Suitable for ultrafast laser experiments and advanced material studies.