Jasper X1 High-Performance Femtosecond Laser System with APoD Technology

• Proven Stability & Exceptional Lifetime: Achieve average power up to 60 W with consistent performance.
• High Pulse Energy: Maximum pulse energy of up to 200 µJ for demanding applications.
• Pulse Tunability: < 270 fs to 20 ps pulse duration range for precise process optimization.
• Superior Beam Quality: All-fiber optical design ensures exceptional beam quality.
• Advanced Pulse-on-Demand: Features Custom Envelope Burst with bursts up to 80 pulses.
• Immediate Reaction to External Triggers: Provides 100-fold improvement in timing accuracy.
• Extended Warranty: 5-year warranty on the oscillator and 2-year on the complete laser system.
• Maintenance-Free Operation: Designed for 24/7 operation with long-term stability.
• Flexible Burst Lengths: Custom Envelope Burst (CEB) for tailored process optimization.
• High Repetition Rate: Maximum pulse repetition rate of 20.0 ± 0.5 MHz, with pulse picking up to 2 MHz.

Applications of the Jasper X1 High-Power Femtosecond Laser

• Ultrafast laser micromachining: Precision micro-processing of metals, ceramics, polymers, glass, semiconductors, and composite materials with minimal heat-affected zone.
• High-precision laser cutting: Clean, burr-free cutting of thin metals, foils, medical alloys, silicon, sapphire, glass, and brittle materials for industrial manufacturing.
• Micro-drilling and via drilling: Fabrication of micro-holes, blind vias, through vias, nozzles, filters, and interconnect structures with excellent dimensional control.
• Glass cutting and glass micro-processing: Femtosecond laser cutting, scribing, drilling, and internal modification of display glass, cover glass, fused silica, borosilicate glass, and specialty optical glass.
• Sapphire and hard-material processing: Precision cutting, drilling, dicing, and surface structuring of sapphire, alumina, zirconia, silicon carbide, and other hard or brittle materials.
• Semiconductor wafer dicing and scribing: High-accuracy processing of silicon wafers, compound semiconductors, MEMS devices, sensors, and microelectronic components.
• Thin-film ablation and patterning: Selective removal and structuring of conductive, dielectric, semiconductor, and functional thin films used in electronics, photovoltaics, sensors, and displays.
• OLED, LCD, and display manufacturing: Fine cutting, trimming, patterning, repair, and structuring of display panels, transparent conductive oxides, glass substrates, and flexible display materials.
• Solar cell manufacturing: Laser scribing, edge isolation, PERC cell processing, thin-film solar patterning, and selective ablation for photovoltaic production.
• Battery manufacturing: Precision laser cutting, notching, texturing, and cleaning of battery electrodes, current collectors, foils, tabs, and separator materials for lithium-ion battery production.
• Medical device manufacturing: High-quality laser cutting, drilling, texturing, and marking of stents, catheters, needles, implants, surgical tools, and biocompatible materials.
• Stent cutting and implant processing: Ultrafast laser machining of stainless steel, nitinol, titanium, cobalt-chrome, and biodegradable implant materials with smooth edges and reduced post-processing.
• Precision laser marking and engraving: Permanent, high-resolution marking of metals, plastics, ceramics, glass, and coated surfaces for traceability, branding, and anti-counterfeiting.
• Surface texturing and functionalization: Creation of micro- and nano-scale surface structures for improved adhesion, wettability, friction control, light trapping, biocompatibility, and hydrophobic or hydrophilic behavior.
• Laser-induced periodic surface structures: Generation of LIPSS and advanced surface patterns for tribology, optics, sensing, decorative finishes, and functional surface engineering.
• Microfluidic device fabrication: Precision machining of channels, reservoirs, vias, and ports in glass, polymers, ceramics, and hybrid substrates for lab-on-a-chip and biomedical devices.
• Optics and photonics manufacturing: Processing of lenses, waveguides, optical fibers, diffractive optical elements, micro-optics, photonic chips, and specialty optical components.
• Waveguide writing and internal glass modification: Three-dimensional refractive index modification inside transparent materials for integrated photonics, optical circuits, and micro-optical devices.
• MEMS and sensor fabrication: Micromachining, trimming, drilling, and structuring of MEMS components, pressure sensors, accelerometers, micro-actuators, and precision sensor substrates.
• Electronics and PCB processing: Microvia drilling, selective coating removal, copper structuring, flex PCB cutting, circuit trimming, and precision processing of electronic substrates.
• Ceramic substrate processing: Laser cutting, drilling, scribing, and structuring of alumina, aluminum nitride, zirconia, and LTCC substrates used in power electronics and advanced packaging.
• Advanced packaging and microelectronics: Fine-feature processing for chip packaging, interposers, redistribution layers, fan-out packaging, and heterogeneous integration.
• Precision trimming and resistor adjustment: Accurate trimming of resistors, sensors, electronic circuits, and functional materials requiring high pulse-to-pulse stability.
• Polymer and composite micromachining:<