Jasper Micro - Compact Femtosecond Fiber Laser

Key Features of the Jasper Micro Compact Femtosecond Fiber Laser

• Compact femtosecond fiber laser designed for high-precision ultrafast laser processing, OEM integration, and demanding scientific or industrial applications.
• All-fiber, SESAM-free architecture supports long-term reliability, excellent stability, and maintenance-free operation.
• Average output power up to 7 W, with typical maximum power up to 7.5 W for efficient ultrafast material processing.
• Pulse energy up to 5.0 µJ, with typical maximum pulse energy up to 5.5 µJ, delivering high peak power from an ultra-compact laser platform.
• Tunable pulse duration from <250 fs to 20 ps, enabling flexible optimization for applications requiring femtosecond or picosecond pulse performance.
• Pulse repetition rate up to 20 MHz for high-throughput processing, precision manufacturing, and advanced research workflows.
• Integrated pulse picker provides flexible pulse repetition rate control for application-specific laser processing requirements.
• Custom Envelope Burst mode option allows adjustment of individual pulse amplitudes within a burst for improved process control and energy delivery.
• Excellent pulse-to-pulse energy stability supports consistent results in precision micromachining, thin-film processing, medical device manufacturing, and microfabrication.
• Superior beam quality enables tight focusing, clean ablation, and high-resolution processing with minimal heat-affected zones.
• Passively cooled laser head eliminates the need for complex cooling infrastructure, reducing system size, noise, and maintenance requirements.
• Ultra-small footprint makes the laser ideal for compact workstations, embedded systems, and space-constrained OEM laser platforms.
• Mountable in any orientation for easy mechanical integration into industrial tools, laboratory systems, and automated production equipment.
• High long-term power stability after warm-up under stable environmental conditions, supporting repeatable operation over extended processing runs.
• Designed for 24/7 industrial reliability with robust construction and a proven ultrafast fiber laser platform.
• Flexible power and pulse control supports a wide range of materials and processes, including metals, polymers, glass, ceramics, semiconductors, and biological materials.
• Ideal for precision applications such as laser micromachining, 3D printing, ophthalmology, medical device processing, micro-drilling, surface texturing, cutting, scribing, and advanced R&D.
• OEM-ready control and integration for use in production workstations, automated laser systems, and custom instrumentation.
• Reliable warranty coverage includes a 5-year warranty on the oscillator and a 2-year warranty on the complete laser system as standard.
• Jasper Micro JM7-5 model configuration combines high average power, femtosecond pulse quality, compact size, and advanced pulse control in a single integrated laser source.

Applications for Jasper Micro Compact Femtosecond Fiber Laser

• Precision femtosecond laser micromachining: Ideal for high-accuracy micro-drilling, micro-cutting, micro-grooving, and micro-structuring of metals, ceramics, glass, polymers, and composite materials with minimal heat-affected zone.
• Ophthalmology and medical laser systems: Suitable for OEM integration into advanced ophthalmic platforms and medical device manufacturing workflows requiring stable ultrafast pulses, compact packaging, and long-term maintenance-free operation.
• Advanced 3D printing and additive manufacturing: Enables high-resolution laser-based 3D printing, two-photon polymerization, micro-additive manufacturing, and precision post-processing of printed microstructures.
• Glass and transparent material processing: Supports precision modification, cutting, engraving, scribing, and internal structuring of glass, fused silica, sapphire, and other transparent materials using ultrashort pulse laser processing.
• Semiconductor and microelectronics manufacturing: Well suited for wafer dicing, thin-film patterning, circuit trimming, micro-via drilling, chip marking, and precise ablation of delicate electronic materials.
• Medical device manufacturing: Used for producing stents, catheters, needles, implants, surgical tools, microfluidic devices, and other high-value medical components requiring clean edges and micron-scale precision.
• Surface texturing and functional surface engineering: Enables creation of micro- and nano-scale textures for improved adhesion, hydrophobicity, friction control, light trapping, biocompatibility, and anti-reflective surfaces.
• Thin-film ablation and selective material removal: Suitable for high-precision removal of coatings, conductive layers, dielectric films, oxides, and multilayer stacks without damaging underlying substrates.
• Photovoltaics and solar cell processing: Applicable for solar cell scribing, edge isolation, thin-film patterning, selective emitter processing, and precision structuring of photovoltaic materials.
• Microfluidics and lab-on-a-chip fabrication: Supports fabrication of microchannels, nozzles, reservoirs, and precision features in glass, polymers, and hybrid substrates for biomedical and analytical devices.
• Scientific research and ultrafast laser experiments: Provides a compact femtosecond laser source for academic, industrial, and applied research in nonlinear optics, ultrafast materials studies, photonics, and laser-matter interaction.
• Nonlinear optics and frequency conversion: Can be used as a stable ultrafast seed or pump laser for nonlinear optical processes, harmonic generation, supercontinuum generation, and wavelength conversion setups.
• Multiphoton and biomedical imaging: Suitable for integration into compact imaging systems requiring stable femtosecond pulses for multiphoton excitation, fluorescence imaging, and advanced microscopy applications.
• Polymer processing and micro-structuring: Enables accurate cutting, marking, welding preparation, and surface modification of polymers with reduced thermal damage compared to longer-pulse laser sources.
• Battery and energy storage manufacturing: Applicable for precision cutting, structuring, drilling, and cleaning of battery electrodes, foils, separators, and advanced energy storage components.
• Display and consumer electronics production: Supports processing of display glass, touch panels, sensors, camera modules, flexible electronics, and miniature components used in smartphones, wearables, and consumer devices.
• Aerospace and defense component fabrication: Useful for high-precision machining, surface functionalization, micro-hole drilling, and material modification of demanding aerospace alloys, ceramics, and specialty materials.
• Automotive electronics and sensor manufacturing: Enables precision processing of sensors, connectors, electronic modules, thin films, and miniaturized components used in modern automotive systems.
• Jewelry, watchmaking, and luxury microfabrication: Suitable for fine engraving, micro-texturing, marking, and precision machining of metals, gemstones, ceramics, and specialty decorative materials.
• OEM laser workstation integration: The compact, passively cooled, all-fiber femtosecond laser design is well suited for integration into industrial laser workstations, automated production tools, and custom manufacturing platforms.