Owl 1280 VIS-SWIR High-Resolution Digital Camera with Low Noise

Specifications

Camera Type: Scientific
Array Type: InGaAs
Spectral Band: 0.4 – 1.7 um
# Pixels (Height): 1024
# Pixels (Width): 1280
Pixel Pitch: 10 um
Array Cooling: Cooled
Frame Rate: 60 Hz
Dynamic Range: 14 Bit
Camera Control: CameraLink
Noise (RMS): <170 (LG), <35 (HG) e-
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Features


  • High Resolution VIS-SWIR Technology: 1280 x 1024 resolution with 10μm pixel pitch, enabling high-quality imaging from 0.4μm to 1.7μm.

  • Exceptional Sensitivity: 640 x 512 resolution with 20μm pitch using 2x2 binning for enhanced low light imaging capabilities.

  • Minimal Readout Noise: Less than 35 electrons readout noise, providing superior VIS-SWIR detection limits.

  • Advanced Automated Gain Control (AGC): On-board AGC ensures clear video output in varying light conditions.

  • Intelligent Non-Uniformity Correction (NUC): On-board 3-point NUC for the highest quality photos.

  • High Frame Rate: Programmable frame rate from 10Hz to 60Hz with 25ns resolution for dynamic imaging.

  • Wide Wavelength Range: Spectral response from 0.4µm to 1.7µm, suitable for diverse applications.

  • Quantum Efficiency: Peak efficiency greater than 85%, with specific efficiencies over 73% at 1.064μm and over 80% at 1.55μm.

  • Global Shutter Mode: Ensures sharp image capture without motion blur.

  • Compact and Lightweight Design: Dimensions of 50mm x 50mm x 61.2mm and weight of 247g, making it easy to integrate into various systems.

  • Flexible Optical Interface: Compatible with C mount and M42, with a selection of SWIR lenses available.

  • Durable Operating Range: Operating case temperature from -20˚C to +55˚C and storage temperature from -30˚C to +60˚C.

  • Low Power Consumption: Less than 3W with TEC off and NUC on, and less than 5W with TEC on.

Applications


  • Surveillance & Laser Detection: Detects 860, 1064 & 1550 nm laser spots for security and targeting.

  • Driving Vision Enhancement (DVE): Enhances visibility for advanced vehicular systems.

  • Airborne & Ground Payloads: Lightweight for UAVs and rugged systems.

  • Astronomy & Beam Profiling: High sensitivity imaging for scientific research.

  • Hyperspectral Imaging: Enables precise spectral analysis in life sciences and materials.

  • Semiconductor & Solar Inspection: Non-destructive evaluation of wafers and cells.

  • Thermography & Vision Enhancement: Broad range thermal and night vision imaging.