25G 1294 nm EML 1309 nm APD BiDi LC BOSA

Specifications

Optical Sub-Assembly (BOSA) Type: BiDi (bi-directional) BOSA, High-Speed BOSA
Threshold Current (typical): 20 mA
Peak Wavelength (typical): 1294 nm
Side Mode Suppression Ratio: 35 dB
Spectral Width: 1 nm
Receiver Sensitivity: -26 dBm
Receiver Responsivity: 4 A/W
Dark Current: 100 nA
Return Loss: 12 dB
Dark Current: 3 uA
Breakdown Voltage: 16 to 26 V
Supply Current: 37 to 50 mA
Supply Voltage: 2.9 to 3.5 V
Peak Wavelength: 1292 to 1296 nm
Tacking Error: -1.5 to 1.5 dB
Storage Temperature: -40 to 85 ℃
Monitor Current (PD): 0.1 to 1.2 mA
Output Optical Power: 4.5 to 7 mW
Threshold Current: 20 to 35 mA
Lead Soldering Temperature (10 Sec): 260 ℃
Laser Forward Current (T=25℃): 150 mA
Reverse Voltage (Laser Diode): 3 V
Operating Temperature: -40 to 85 ℃
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Features

  • LC Receptacle Bi-directional Operation: Enables efficient data transmission in both directions.
  • Integrated WDM Filter: Combines multiple wavelengths for enhanced performance.
  • Un-cooled Operation: Functions effectively in temperatures ranging from -40℃ to 85℃.
  • 25Gbps NRZ Data Rate: Supports high-speed data transfer for demanding applications.
  • Optical Isolator Included: Reduces interference and enhances signal integrity.
  • Compliance with Telcordia GR-468 and ROHS: Meets industry standards for reliability and environmental safety.

Applications

High-performance industrial applications