25G 1270 nm DFB 1330 nm PD LC BIDI BOSA

Specifications

Optical Sub-Assembly (BOSA) Type: BiDi (bi-directional) BOSA, High-Speed BOSA
Threshold Current (typical): 8 mA
Peak Wavelength (typical): 1271 nm
Side Mode Suppression Ratio: 35 dB
Spectral Width: 1 nm
Receiver Sensitivity: -11.5 dBm
Receiver Responsivity: 0.65 A/W
Tacking Error: -1.5 to 1.5 dB
Return Loss: 12 dB
Saturation Power: 2.5 dBm
Supply Current: 25 to 34 mA
Supply Voltage: 3 to 3.6 V
Peak Wavelength: 1271 to 1277.5 nm
Storage Temperature: -40 to 85 ℃
Dark Current: 100 nA
Monitor Current (PD): 0.043 to 1 mA
Output Optical Power: 0.35 to 0.7 mW
Threshold Current: 8 to 12 mA
Lead Soldering Temperature (10 Sec): 260 ℃
Laser Forward Current (T=25℃): 100 mA
Reverse Voltage (Laser Diode): 2 V
Operating Temperature: -40 to 85 ℃
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Features

  • LC Receptacle Bi-directional Operation: Ensures efficient data transmission in both directions.
  • Integrated WDM Filter: Combines multiple signals on different wavelengths for improved performance.
  • Un-cooled Operation from -40℃ to 85℃: Reliable performance across a wide temperature range.
  • Data Rate for 25Gbps: High-speed data transfer capability.
  • Includes Optical Isolator: Reduces interference and enhances signal integrity.
  • Compliance with Telcordia GR-468 and ROHS: Meets industry standards for reliability and environmental safety.

Applications

High-speed data transmission in industrial temperature environments