The 1535 nm Micro-Chips laser core from LASERTEC INC is an innovative solution designed to enhance the performance of Er, Yb:glass lasers. By integrating Er, Yb:glass with Co:spinel bonding crystal, this product significantly improves the overall efficiency and stability of laser systems. The unique bonding process involves attaching Co:spinel at the end of Er, Yb:glass, which effectively mitigates thermal effects, a common challenge in high-energy density lasers.

This advanced design ensures that the laser maintains optimal performance even under demanding conditions. The bonding of Er, Yb:glass with Co:spinel offers numerous advantages. It enhances the thermal management of the laser, reducing the thermal lens effect that typically occurs during laser pumping. This improvement leads to better beam quality and increased output efficiency of the 1535 nm laser. Additionally, the stability of the laser's output capacity is significantly improved, contributing to a longer service life. The surface activation bonding technology employed in this process operates at low or normal temperatures, ensuring high bonding strength and minimal absorption loss on the bonding surface.

The Er, Yb:glass+Co:spinel bonded crystals are characterized by their high bonding strength and minimal changes in bonding surface shape, with absorption loss generally less than 20ppm. This makes them ideal for applications requiring precise and reliable laser performance. The product is particularly suited for use in laser lidar and laser rangefinders, where consistent and high-quality laser output is crucial. LASERTEC INC's commitment to quality and innovation is evident in the meticulous design and engineering of this laser core, making it a valuable asset for advanced laser applications.